ELECTRONIC APPARATUS
First Claim
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1. An electronic apparatus comprising:
- a housing;
a heat-producing element in the housing;
a first heat absorber configured to absorb heat from the heat-producing element, the first heat absorber located on an inner surface of the housing facing the heat-producing element;
a second heat absorber configured to absorb heat in the housing, the second heat absorber located on the inner surface of the housing at a separate position from the first heat absorber; and
a heat transfer member configured to transfer heat absorbed by the first heat absorber to the second heat absorber.
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Abstract
According to one embodiment, an electronic apparatus includes a housing, a heat-producing element, a first heat absorber, a second heat absorber and a heat transfer member. The heat-producing element produces heat in the housing. The first heat absorber is provided on an inner surface of the housing to face the heat-producing element. The first heat absorber absorbs heat from the heat-producing element in the housing. The second heat absorber is provided on the inner surface of the housing at a position separate from the first heat absorber. The heat transfer member transfers heat from the heat-producing element absorbed by the first heat absorber to the second heat absorber.
16 Citations
12 Claims
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1. An electronic apparatus comprising:
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a housing; a heat-producing element in the housing; a first heat absorber configured to absorb heat from the heat-producing element, the first heat absorber located on an inner surface of the housing facing the heat-producing element; a second heat absorber configured to absorb heat in the housing, the second heat absorber located on the inner surface of the housing at a separate position from the first heat absorber; and a heat transfer member configured to transfer heat absorbed by the first heat absorber to the second heat absorber. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic apparatus comprising:
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a housing; multiple circuit components in the housing, the circuit components configured to operate not simultaneously, and thereby limit heat produced during operation; multiple heat absorbers on an inner surface of the housing, each of the heat absorbers corresponding to each of the circuit components, and the heat absorbers configured to absorb heat from the circuit components; and a heat transfer member configured to transfer heat between the heat absorbers. - View Dependent Claims (8, 9)
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10. An electronic apparatus comprising:
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a housing; a heat-producing element configured to produce heat in the housing; and multiple heat absorbers in the housing, one of the heat absorbers located at an area corresponding to the heat-producing element and the other heat absorbers located at areas, separate from the heat-producing element; wherein the heat absorbers comprise; depressions on the inner surface of the housing; phase-change materials filled in the depressions, the phase-change materials configured to absorb heat by changing phase from a solid to a liquid; and thermally conductive sheets configured to seal the depressions, and the heat absorbers are thermally connected through a heat transfer member. - View Dependent Claims (11, 12)
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Specification