COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM

• US 20160021803A1
• Filed: 07/14/2015
• Published: 01/21/2016
• Est. Priority Date: 07/17/2014
• Status: Abandoned Application

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: TAKEHARA, Hirokazu, YAMAZAKI, Takuya, SAGARA, Hiroki, IWATA, Isato
• Application Number:
  US14/798,861
• Publication Number:
  US 20160021803A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 30/20 Design optimisation, verification or simulation optimisation, verification or simulation of circuit designs G06F30/30
• CPC Class Codes: H05K 13/085 Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Abstract

A component mounting method is provided in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data. The method includes executing, when the component data is changed, a simulation of a production cycle time based on the production data, and making an improvement plan for the production cycle time as a target based on a simulation result after change of the component data, and outputting the improvement plan.

Claims

1. A component mounting method in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data, the method comprising:

executing, when the component data is changed, a simulation of a production cycle time based on the production data; and

making an improvement plan for the production cycle time as a target based on a simulation result after change of the component data, and outputting the improvement plan.

2. The component mounting method according to claim 1, wherein the improvement plan includes at least one of a change of an operation sequence of a component mounting operation in which the component is extracted by a suction nozzle and mounted onto the board, a change in component arrangement in a component supply section, an addition of a suction nozzle type to be used, and an exchange of a component arrangement between plural component mounting apparatuses, in the component mounting apparatus.

3. A component mounting system that mounts a component onto a board using a plurality of pieces of production data linked to component data, the system comprising:

a component mounting line that includes a component mounting apparatus that executes an operation of mounting the component onto the board;

a simulation executing section that executes, when the component data is changed, a simulation of a production cycle time based on the production data; and

an improvement plan outputting section that makes an improvement plan for the production cycle time as a target based on a simulation result after change of the component data, and outputs the improvement plan.

4. The component mounting system according to claim 3, wherein the improvement plan includes at least one of a change of an operation sequence of a component mounting operation in which the component is extracted by a suction nozzle and mounted onto the board, a change in component arrangement in a component supply section, an addition of a suction nozzle type to be used, and an exchange of a component arrangement between plural component mounting apparatuses, in the component mounting apparatus.