DEFECT FREE SINGLE CRYSTAL THIN LAYER
First Claim
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1. A method for preparing III-V semiconductor film comprising:
- irradiating a surface of a substrate including the III-V semiconductor; and
contacting the surface of the substrate while irradiating with a solution containing an etching solution to form the film on the substrate.
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Abstract
A gallium nitride film can be a dislocation free single crystal, which can be prepared by irradiating a surface of a substrate and contacting the surface with an etching solution that can selectively etch at dislocations.
23 Citations
30 Claims
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1. A method for preparing III-V semiconductor film comprising:
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irradiating a surface of a substrate including the III-V semiconductor; and contacting the surface of the substrate while irradiating with a solution containing an etching solution to form the film on the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 10, 11, 12, 13, 14, 16, 17, 18, 19, 20, 21, 22)
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9. (canceled)
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15. (canceled)
- 23. A film comprising dislocation free single crystalline III-V semiconductor, wherein the dislocation free single crystalline III-V semiconductor has a thickness of between 10 nanometers and 1 micron nanometers.
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28. A structure comprising dislocation free single crystalline III-V semiconductor on a substrate, wherein the substrate is a polymer substrate, copper substrate, silicon substrate, glass substrate, silicon carbide substrate, sapphire substrate, quartz substrate, porcelain substrate, indium phosphide substrate, gallium nitride substrate, gallium arsenide substrate, beryllium oxide substrate, aluminum nitride substrate, alumina substrate, plastic substrate, or ceramic substrate.
- 29. A device for growing III-V semiconductor comprising a film, wherein the film includes dislocation free single crystalline III-V semiconductor, and wherein the film has a thickness of 10 nanometers to 1 micron.
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