METHOD OF ENCAPSULATING AN OPTOELECTRONIC DEVICE AND LIGHT-EMITTING DIODE CHIP
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Abstract
A method of encapsulating an optoelectronic device includes providing a surface intended to be encapsulated, the surface containing platinum, generating reactive oxygen groups and/or reactive hydroxyl groups on the surface, and depositing a passivation layer by atomic layer deposition on the surface.
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Citations
28 Claims
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1-14. -14. (canceled)
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15. A method of encapsulating an optoelectronic device comprising:
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providing a surface intended to be encapsulated, said surface containing platinum; generating reactive oxygen groups and/or reactive hydroxyl groups on said surface; and depositing a passivation layer by atomic layer deposition on said surface. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of encapsulating an optoelectronic device comprising:
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providing a surface intended to be encapsulated; generating reactive oxygen groups and/or reactive hydroxyl groups on said surface; and depositing a passivation layer by atomic layer deposition on said surface.
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Specification