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PACKAGE-IN-PACKAGE SEMICONDUCTOR SENSOR DEVICE

  • US 20160027992A1
  • Filed: 07/22/2014
  • Published: 01/28/2016
  • Est. Priority Date: 07/22/2014
  • Status: Active Grant
First Claim
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1. A method for assembling a semiconductor sensor device, the method comprising:

  • a) providing a sensor substrate having a front side and a back side;

    b) forming an opening through the sensor substrate;

    c) flip-chip bonding a pressure sensor die to the front side of the sensor substrate;

    d) filling a region between the pressure sensor die and the sensor substrate with a pressure-sensitive gel; and

    e) encapsulating the sensor substrate, the pressure sensor die, and the pressure-sensitive gel with a molding compound, leaving the back side of the sensor substrate exposed.

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