PACKAGE-IN-PACKAGE SEMICONDUCTOR SENSOR DEVICE
First Claim
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1. A method for assembling a semiconductor sensor device, the method comprising:
- a) providing a sensor substrate having a front side and a back side;
b) forming an opening through the sensor substrate;
c) flip-chip bonding a pressure sensor die to the front side of the sensor substrate;
d) filling a region between the pressure sensor die and the sensor substrate with a pressure-sensitive gel; and
e) encapsulating the sensor substrate, the pressure sensor die, and the pressure-sensitive gel with a molding compound, leaving the back side of the sensor substrate exposed.
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Abstract
A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.
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Citations
20 Claims
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1. A method for assembling a semiconductor sensor device, the method comprising:
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a) providing a sensor substrate having a front side and a back side; b) forming an opening through the sensor substrate; c) flip-chip bonding a pressure sensor die to the front side of the sensor substrate; d) filling a region between the pressure sensor die and the sensor substrate with a pressure-sensitive gel; and e) encapsulating the sensor substrate, the pressure sensor die, and the pressure-sensitive gel with a molding compound, leaving the back side of the sensor substrate exposed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A semiconductor sensor device, comprising:
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a device substrate; a micro controller unit (MCU) die attached to the device substrate; a pressure sensor package having a sensor substrate and a pressure sensor die electrically connected to the sensor substrate, the sensor substrate having a front side with the pressure sensor die attached thereto, a back side, and an opening from the front side to the back side; and a molding compound encapsulating the MCU die, the device substrate, and the pressure sensor package, the molding compound having an outer surface; wherein the back side of the sensor substrate and the opening in the sensor substrate are exposed on the outer surface of the molding compound. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification