A LIQUID COOLED DEVICE ENCLOSURE

• US 20160029514A1
• Filed: 04/08/2014
• Published: 01/28/2016
• Est. Priority Date: 12/31/2013
• Status: Abandoned Application

• Current Assignee: Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
• Original Assignee: Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi
• Inventors: ALAKOC, Ugur, KAYNAKOZ, Muharrem, AYYILMAZ, Tolga
• Application Number:
  US14/434,406
• Publication Number:
  US 20160029514A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20645 within cabinets for removing heat from sub-racks

Abstract

The present invention essentially relates to a liquid cooled device enclosure (1) which is designed for cooling electronic modules having high heat dissipation by using micro channel liquid cooling method.

Claims

1. A liquid cooled device enclosure, which is used for cooling electronic components having high heat dissipation, comprising:

at least one device enclosure,

a plurality of device chassis sidewalls located vertical to the ground correspondingly,

a plurality of device chassis slotted walls which is vertical to the ground and forms a device chassis by connecting with the device chassis sidewalls,

at least one lower lid which is located parallel to the ground on the part of the device chassis facing the ground,

at least one upper lid which is parallel to the lower lid, vertical to the device chassis sidewalls and the device chassis slotted walls, and covers the device chassis,

a plain liquid channel which is located on the device chassis sidewalls, at least one electronic module compartment which is located on the inner surfaces of the device chassis slotted walls,

an electronic module compartment sidewall which is the surface of the electronic module compartment facing a device chassis front panel,

a plurality of electronic module compartment slotted walls which is the inner surface of the electronic module compartments facing each other,

at least one slot which is present on the electronic module compartment slotted walls correspondingly and in which a plurality of electronic modules are located,

at least one inlet liquid quick coupling which is present on the outer surface of the device chassis and through which liquid enters into the device chassis,

at least one outlet liquid quick coupling which is present on the outer surface of the device chassis and through which liquid exits out of the device chassis,

a plurality of liquid channels which corresponds to the slot and are present on the electronic module compartment slotted walls,

at least one micro channel which is present on the liquid channels corresponding to the slot,

at least one device front panel which provides an interface for a device connectors and protects the front surface of the device chassis by covering.

2. The liquid cooled device enclosure of claim 1, wherein the micro channel is present in the liquid channels corresponding to the slot.

3. The liquid cooled device enclosure of claim 1, wherein liquid enters into the device chassis through the inlet liquid quick coupling which is present on the outer surface of the device chassis;

wherein liquid flows through the electronic module compartment slotted walls with serpentine flow pattern.

4. The liquid cooled device enclosure of claim 1, wherein liquid passes to the electronic module compartment slotted walls through the plain liquid channel which is preferably circular along the device chassis sidewall.

5. The liquid cooled device enclosure of claim 4, wherein liquid passes through the plain liquid channel on the devices chassis sidewalls after liquid flows through the liquid channels with serpentine flow pattern through the electronic module compartment slotted walls.

6. The liquid cooled device enclosure of claim 1, wherein the device chassis slotted walls are located correspondingly on the device chassis and the electronic modules are attached to the device chassis slotted walls.

7. The liquid cooled device enclosure of claim 1, wherein the slot is located on the edges of the device chassis;

wherein heat generated by the electronic module is transferred via a conduction.

8. The liquid cooled device enclosure of claim 1, wherein the device chassis cooled by the fluid flowing through the plain liquid channels on the device chassis sidewalls and the liquid channels on the electronic module compartment slotted walls.

9. The liquid cooled device enclosure of claim 1, wherein the micro channel is located on the liquid channels corresponding to the electronic module compartment slotted walls;

wherein the electronic modules with high heat dissipation are attached to the electronic module compartment slotted walls.

10. The liquid cooled device enclosure of claim 9, wherein the micro channels is present in the liquid channels and enables the transfer of heat generated by the electronic modules to flow more effectively by increasing the heat transfer area and forced convection in the liquid channels.

11. The liquid cooled device enclosure of claim 1, wherein the lower lid and the upper lid present under and above the device chassis;

wherein the lower lid and the upper lid prevent the contact of the electronic modules with the environment and provide sealing.

12. The liquid cooled device enclosure of claim 1, wherein the device chassis enables three dimensional to flow inside the liquid channels;

wherein the device chassis is manufactured by brazing and post-machining after brazing.

13. The liquid cooled device enclosure of claim 1, wherein the device chassis, the plain liquid channel and the liquid channels are presented on the electronic module compartment slotted walls;

wherein liquid flows are designed to avoid the electronic modules malfunctioning in case of a liquid leakage since the electronic modules are not in contact with the cooling surface under which liquid passes.

14. The liquid cooled device enclosure of claim 1, wherein the device chassis, the plain liquid channel and the liquid channels are presented on the electronic module compartment slotted walls in which a deionized water flows in a single phase.

15. The liquid cooled device enclosure of claim 1, wherein the device chassis, the plain liquid channel and the liquid channels are presented on the electronic module compartment slotted walls in which a coolant is obtained by mixing ethylene glycol and deionized water in different amounts and the coolant flows in single phase.

16. The liquid cooled device enclosure of claim 1, wherein the device chassis, the plain liquid channel and the liquid channels are presented on the electronic module compartment slotted walls in which the coolant is obtained by mixing ethylene glycol, deionized water and anti-corrosive liquid in different amounts and the coolant flows in single phase.

17. The liquid cooled device enclosure of claim 1, wherein the device chassis, the plain liquid channel and the liquid channels are presented on the electronic module compartment slotted walls in which electrically non-conductive per fluorocarbon fluids flow in two phases (liquid and gas).

18. The liquid cooled device enclosure of claim 1, wherein the device chassis, the plain liquid channel and the liquid channels are presented on the electronic module compartment slotted walls in which chlorofluorocarbon fluids flow in two phase.

19. The liquid cooled device enclosure of claim 1, wherein the device chassis, the plain liquid channel and the liquid channels are presented on the electronic module compartment slotted walls in which hydro fluorocarbon fluids flow in two phase.