PRESSURE SENSING IMPLANT
First Claim
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1. A circuit comprising:
- a housing having a plurality of walls and at least one opening;
a sensor connected to an opening in said housing, said sensor comprising;
a first layer having a first dimension;
a second layer having a second dimension shorter than said first dimension; and
wherein said second layer is positioned entirely within said housing and a surface of said first layer is exposed to an exterior of said housing.
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Abstract
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
38 Citations
15 Claims
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1. A circuit comprising:
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a housing having a plurality of walls and at least one opening; a sensor connected to an opening in said housing, said sensor comprising; a first layer having a first dimension; a second layer having a second dimension shorter than said first dimension; and wherein said second layer is positioned entirely within said housing and a surface of said first layer is exposed to an exterior of said housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification