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APPARATUSES AND METHODS FOR COOLING A SURFACE

  • US 20160030233A1
  • Filed: 08/01/2014
  • Published: 02/04/2016
  • Est. Priority Date: 08/01/2014
  • Status: Abandoned Application
First Claim
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1. An apparatus configured to provide localized cooling of a surface, the apparatus comprising:

  • at least one cooling interface configured to contact the surface; and

    at least one solid-state thermoelectric element thermally coupled to the at least one cooling interface, the at least one solid-state thermoelectric element being configured to facilitate a conductive transfer of heat from the surface through the at least one cooling interface, thereby decreasing a temperature of the surface.

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