PLASMA PROCESSING APPARATUS AND GAS SUPPLY MEMBER

• US 20160035541A1
• Filed: 07/30/2015
• Published: 02/04/2016
• Est. Priority Date: 07/31/2014
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: KOZUKA, Shinichi, NIITSUMA, Ryosuke, ISHIKAWA, Manabu
• Application Number:
  US14/813,207
• Publication Number:
  US 20160035541A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01J 2237/334 Etching
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/3266 Magnetic control means

Abstract

Disclosed is a plasma processing apparatus including: a processing container; a support member provided within the processing container and configured to support a processing target substrate; and a gas supply member including a first region formed with a gas supply hole, a second region not formed with a gas supply hole, and a third region formed with a gas supply holes. The first to third regions are disposed sequentially from a central portion side of the processing target substrate along a radial direction of the processing target substrate, and the plasma processing apparatus is processed to introduce a processing gas from the gas supply holes of the gas supply member for plasma processing of the processing target substrate into the processing container.

Claims

1. A plasma processing apparatus comprising:

a processing container;

a support member provided within the processing container and configured to support a processing target substrate; and

a gas supply member including a first region formed with a gas supply hole, a second region not formed with a gas supply hole, and a third region formed with a gas supply hole, the first region, the second region, and the third region being disposed sequentially from a central portion side of the processing target substrate along a radial direction of the processing target substrate,

wherein the plasma processing apparatus is processed to introduce a processing gas from the gas supply holes of the gas supply member for plasma processing of the processing target substrate into the processing container.

2. The plasma processing apparatus of claim 1, wherein the gas supply hole formed in the third region is disposed at a position outside a position inwardly spaced apart from a periphery of the processing target substrate by 10 mm along the radial direction of the processing target substrate.

3. The plasma processing apparatus of claim 1, wherein the gas supply hole formed in the third region is disposed in a range from a position inwardly spaced apart from a periphery of the processing target substrate by 10 mm to a position outwardly spaced apart from the periphery of the processing target substrate by 10 mm along the radial direction of the processing target substrate.

4. The plasma processing apparatus of claim 1, wherein the gas supply hole formed in the third region is disposed at a position outside or on a periphery of the processing target substrate.

5. The plasma processing apparatus of claim 1, wherein the gas supply hole formed in the third region has an inclined portion that is inclined with respect to a central axis of the processing target substrate so that a distance along the radial direction of the processing target substrate from the central axis of the processing target substrate is increased as the inclined portion gets closer to the processing target substrate.

6. A gas supply member configured to supply a processing gas into a processing container in which a processing target substrate is disposed, the gas supply member comprising:

a first gas supply region disposed at a center portion side with respect to a central line between a central portion and an edge portion of the gas supply member, and formed with a plurality of first gas supply holes;

a second gas supply region disposed at an edge portion side with respect to the central line between the central portion and an edge portion of the gas supply member, and formed with a second gas supply hole; and

a non-gas supply region disposed between the first gas supply region and the second gas supply region, and not formed with a gas supply hole.

7. The gas supply member of claim 6, wherein the second gas supply hole is disposed at a position outside or on a periphery of the processing target substrate.

8. The gas supply member of claim 6, wherein the second gas supply hole has an inclined portion that is inclined with respect to a central axis of the processing target substrate so that a distance along the radial direction of the processing target substrate from the central axis of the processing target substrate is increased as the inclined portion gets closer to the processing target substrate.