GALNASSB SOLID SOLUTION-BASED HETEROSTRUCTURE, METHOD FOR PRODUCING SAME AND LIGHT EMITTING DIODE BASED ON SAID HETEROSTRUCTURE

• US 20160035931A1
• Filed: 09/10/2013
• Published: 02/04/2016
• Est. Priority Date: 09/07/2012
• Status: Abandoned Application

• Current Assignee: Limited Liability Company LED Microsensor NT
• Original Assignee: Limited Liability Company LED Microsensor NT
• Inventors: ZHURTANOV, Bizhigit Erzhigitovich, STOYANOV, Nikolay Deev
• Application Number:
  US14/426,825
• Publication Number:
  US 20160035931A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/02398 Antimonides
• CPC Class Codes: H01L 21/02463 Arsenides
• CPC Class Codes: H01L 21/02466 Antimonides
• CPC Class Codes: H01L 21/02546 Arsenides
• CPC Class Codes: H01L 21/02549 Antimonides
• CPC Class Codes: H01L 21/02623 Liquid deposition
• CPC Class Codes: H01L 33/0025 comprising only AIIIBV compounds
• CPC Class Codes: H01L 33/0062 for devices with an active region comprising only III-V compounds
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/30 containing only elements of Group III and Group V of the Periodic Table

Abstract

The provided heterostructure includes a substrate containing GaSb, a buffer layer which contains a GaInAsSb solid solution, the buffer layer being disposed over the substrate; an active layer which contains a GaInAsSb solid solution, the active layer being disposed over the buffer layer; a confining layer for localizing major carriers, the confining layer containing a AlGaAsSb solid solution and being disposed over the active layer; a contact layer containing GaSb, the contact layer being disposed over the confining layer, wherein the buffer layer contains less indium (In) than the active layer. The provided heterostructure is characterized by increased quantum efficiency. Also a method of producing the heterostructure and a light emitting diode based on the heterostructure are provided. Light emitting diodes on the basis of the provided heterostructure emit in a mid-infrared spectral range of 1.8-2.4 μm.

Claims

1. A heterostructure based on a GaInAsSb solid solution, the hetero structure comprising:

a substrate containing GaSb;

a buffer layer which contains a GaInAsSb solid solution, the buffer layer being disposed over the substrate;

an active layer which contains a GaInAsSb solid solution, the active layer being disposed over the buffer layer;

a confining layer for localizing major carriers, the confining layer containing a AlGaAsSb solid solution and being disposed over the active layer;

a contact layer containing GaSb, the contact layer being disposed over the confining layer,

wherein the buffer layer contains less indium (In) than the active layer.

2. The heterostructure of claim 1, wherein a mole fraction of indium (In) among the elements of the group III in the buffer layer is 1.2-1.6%.

3. A method of producing a heterostructure based on a GaInAsSb solid solution, according to which, using a liquid epitaxy technique:

a p-type conduction buffer layer is grown on an n-type conduction GaSb substrate, the buffer layer containing a GaInAsSb solid solution;

an n-type conduction active layer is grown on the buffer layer, the active layer containing a GaInAsSb solid solution, so that the active layer contains more indium (In) than the buffer layer;

a p-type conduction confining layer for localizing major carriers is grown on the active layer, the confining layer containing a AlGaAsSb solid solution;

a p-type conduction contact layer containing GaSb is grown on the confining layer.

4. A light-emitting diode comprising:

at least one LED chip which is formed on the basis of a heterostructure based on a GaInAsSb solid solution, the heterostructure comprising;

a substrate containing GaSb;

a buffer layer which contains a GaInAsSb solid solution, the buffer layer being disposed over the substrate;

an active layer which contains a GaInAsSb solid solution, the active layer being disposed over the buffer layer;

a confining layer for localizing major carriers, the confining layer containing a AlGaAsSb solid solution and being disposed over the active layer;

a contact layer containing GaSb, the contact layer being disposed over the confining layer, wherein the buffer layer contains less indium (In) than the active layer, wherein the at least one LED chip comprises a first contact formed on the active layer side of the heterostructure and a second contact formed on the substrate side of the heterostructure.

5. The light-emitting diode of claim 4, wherein the first contact is formed continuous, and the second contact is formed with a partially covered surface.

6. The light-emitting diode of claim 4, wherein the second contact is ring-shaped.

7. The light-emitting diode according to claim 4, wherein the first contact contains a Cr/(Au+Zn)/Ni/Au four-layer system, and the second contact contains a Cr/(Au+Te)/Ni/Au four-layer system.

8. A method of producing a light-emitting diode, the method including:

providing a heterostructure based on a GaInAsSb solid solution, the heterostructure comprising;

a substrate containing GaSb;

a buffer layer which contains a GaInAsSb solid solution, the buffer layer being disposed over the substrate;

an active layer which contains a GaInAsSb solid solution, the active layer being disposed over the buffer layer;

a confining layer for localizing major carriers, the confining layer containing a AlGaAsSb solid solution and being disposed over the active layer;

a contact layer containing GaSb, the contact layer being disposed over the confining layer, wherein the buffer layer contains less indium (In) than the active layer;

reducing the thickness of the substrate;

forming a first contact on the heterostructure on the active layer side of the heterostructure;

forming a second contact on the heterostructure on the substrate side of the heterostructure;

splitting the heterostructure with the contacts formed thereon to form LED chips.

9. A light-emitting diode comprising at least one LED chip which is formed on the basis of a heterostructure based on a GaInAsSb solid solution, the heterostructure comprising:

a substrate containing GaSb;

a buffer layer which contains a GaInAsSb solid solution, the buffer layer being disposed over the substrate;

an active layer which contains a GaInAsSb solid solution, the active layer being disposed over the buffer layer;

a confining layer for localizing major carriers, the confining layer containing a AlGaAsSb solid solution and being disposed over the active layer;

a contact layer containing GaSb, the contact layer being disposed over the confining layer, wherein the buffer layer contains less indium (In) than the active layer, wherein the at least one LED chip comprises at least one contact connected to the contact layer on the active layer side of the heterostructure and at least one contact connected to the substrate on the active layer side of the heterostructure.

10. A method of producing a light-emitting diode, the method including:

providing a heterostructure based on a GaInAsSb solid solution, the heterostructure comprising;

a substrate containing GaSb;

a buffer layer which contains a GaInAsSb solid solution, the buffer layer being disposed over the substrate;

an active layer which contains a GaInAsSb solid solution, the active layer being disposed over the buffer layer;

a confining layer for localizing major carriers, the confining layer containing a AlGaAsSb solid solution and being disposed over the active layer;

a contact layer containing GaSb, the contact layer being disposed over the confining layer, wherein the buffer layer contains less indium (In) than the active layer,

forming a first contact connected to the contact layer on the heterostructure on the active layer side of the heterostructure, the first contact being connected to the contact layer;

forming a second contact on the heterostructure on the active layer side of the heterostructure, the second contact being connected to the substrate;

reducing the thickness of the substrate;

splitting the heterostructure with the contacts formed thereon to form LED chips.