LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

• US 20160035952A1
• Filed: 10/15/2015
• Published: 02/04/2016
• Est. Priority Date: 02/09/2010
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: YAMADA, Motokazu, Seno, Ryota, Kamada, Kazuhiro
• Granted Patent: US 9,887,329 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01063 : Europium [Eu]
• CPC Class Codes: H01L 2924/01065 : Terbium [Tb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 33/005 : Processes
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).

Claims

1. A light emitting device comprising:

a light emitting element having a semiconductor layer and a transparent substrate;

a reflective member exposing at least apart of side surfaces and a top surface of the transparent substrate and covering side surfaces of the semiconductor layer; and

a light transmissive member covering a portion of the transparent substrate exposed from the reflective member.

2. The light emitting device according to claim 1 further comprising a base member and electrically conductive members disposed on the base member, wherein the light emitting element is mounted on the electrically conductive members, at a surface of the electrically conductive members, at least a portion of which does not have the light emitting element mounted thereon is covered with an insulating filler which is the reflective member, and the light transmissive member covers the light emitting element.

3. The light emitting device according to claim 2, wherein the base member has a recess and the electrically conductive members are disposed on a bottom surface and side surfaces of the recess, and the light emitting element is mounted on the bottom surface of the recess.

4. The light emitting device according to claim 3, wherein the side surfaces of the recess has, at a portion abutting on a top edge surface of the recess have a region where an electrically conductive member is not formed.

5. The light emitting device according to claim 3, wherein the side surfaces of the recess at a portion abutting on the bottom surface of the recess have a region where an electrically conductive member is not formed.

6. The light emitting device according to claim 3, wherein at a top edge surface side of the recess, side surfaces of the recess have a step, and a side surface of the step has a region where an electrically conductive member is not formed.

7. The light emitting device according to claim 6, wherein a shortest distance between a highest surface of bottom surfaces of the step to a surface of the light transmissive member is ⅕

or less with respect to the height of the recess.

8. The light emitting device according to claim 1, wherein the surface of the light transmissive member has a recessed shape.

9. The light emitting device according to claim 2 or claim 3, wherein the filler is applied to a thickness of 5 •

m or greater.

10. The light emitting device according to claim 2 or claim 3, wherein a reflectance of the filler is 50% or greater to light of an emission wavelength.

11. The light emitting device according to claim 2 or claim 3, wherein the filler covers a surface of the light emitting element, and a surface area of a single light emitting element which is covered with the filler is less than 50% of the entire surface area of the single light emitting element.

12. The light emitting device according to claim 2 or claim 3, wherein the electrically conductive members respectively have a positive electrode and a negative electrode, the electrodes are disposed spaced apart from each other on the base member, and the filler is applied covering at least a portion between the electrodes.

13. The light emitting device according to claim 12, wherein the distance between the electrodes is 200 •

m or less.

14. The light emitting device according to claim 2 or claim 3, wherein the light emitting element is mounted in a flip-chip mounting manner.

15. The light emitting device according to claim 2 or claim 3, wherein a protective element is mounted in the light emitting device, and 50% or more of the surface area of the protective element is covered with the filler.

16. The light emitting device according to claim 2 or claim 3, wherein at least a portion of the filler is covered with a light blocking member.

17. The light emitting device according to claim 16, wherein the light blocking member covers a side walls of the base member.

18. The light emitting device according to claim 2 or claim 3, wherein the light transmissive member covers the filler in addition to the light emitting element.

19. A light emitting device comprising:

a base member;

electrically conductive members disposed on the base member;

a light emitting element disposed on the electrically conductive members;

a wire electrically connecting each electrode portion of the electrically conductive members with respective electrode terminals of the light emitting element;

an insulating filler covering an electrically conductive portion which does not have the light emitting element mounted thereon and a lower surface of the wires; and

a light transmissive member covering the light emitting element and the filler.

20. The light emitting device according to claim 2, claim 3, or claim 19, wherein gaps among the filler are impregnated with a light transmissive member.

21. The light emitting device according to claim 20, wherein in a region covered with the filler, the filler is contained more than 50 volume percent with respect to a volume of the impregnated filler.

22. A light emitting device comprising:

a light emitting element having a semiconductor layer and a positive electrode and a negative electrode respectively disposed on respective surfaces of the semiconductor layer;

electrically conductive members each bonded to the positive electrode and negative electrode respectively;

a reflective member covering side surfaces of the positive electrode and negative electrode and side surfaces of the electrically conductive members; and

a light transmissive member covering an upper surface opposite to the respective surfaces having the electrodes disposed thereon and side surfaces of the light emitting element.

23. The light emitting device according to claim 22, wherein the reflective member is exposed at a side surface of the light emitting device.

24. The light emitting device according to claim 22, wherein interface between the light transmissive member and the reflective member is located at a side surface side of the light emitting element.

25. The light emitting device according to claim 22, wherein a thickness from an upper surface of the light emitting element to an upper surface of the light transmissive member is approximately the same as a thickness from a side surface of the light emitting element to aside surface of the light transmissive member.

26. The light emitting device according to claim 22, wherein a thickness from an upper surface of the light emitting element to an upper surface of the light transmissive member is smaller than a thickness from a side surface of the light emitting element to a side surface of the light transmissive member.

27. The light emitting device according to claim 22, wherein the light transmissive member contains a wavelength converting member.

28. A method of manufacturing a light emitting device comprising the steps of:

bonding electrodes of a plurality of light emitting elements on a support substrate; and

disposing a reflective member on the support substrate of at least around the electrodes of the light emitting elements by using an electrolytic plating technique, an electrodeposition coating technique, or an electrostatic coating technique.

34. The method of manufacturing a light emitting device according to claim 28 further comprising the steps of:

disposing a light transmissive member on the reflective member to cover a side surface and an upper surface of the light emitting element; and

dividing the light emitting element into individual units comprising removing the support substrate and dividing the reflective member and light transmissive member.

35. The method of manufacturing a light emitting device according to claim 34, wherein in the step of disposing the light transmissive member, the light transmissive member is impregnated in the reflective member.

36. The method of manufacturing a light emitting device according to claim 34, wherein the light transmissive member preferably contains a wavelength converting member.

29. A method of manufacturing a light emitting device comprising the steps of:

forming electrically conductive members on a base member which is a support substrate;

mounting alight emitting element on the conductive member by die-bonding;

applying an insulating filler, which is a reflective member, to cover a portion of a surface of the respective electrically conductive members where the light emitting element is not disposed, by using an electrolytic plating technique, an electrodeposition technique, or an electrostatic coating technique; and

covering the light emitting element with a light transmissive member.

30. The method of manufacturing a light emitting device according to claim 29 in which the base substrate has a recess, wherein electrically conductive members are disposed on a bottom surface and a side surface of the recess, and a light emitting element is mounted on the bottom surface of the recess.

31. The method of manufacturing a light emitting device according to claim 29 or claim 30, wherein the filler is applied to a thickness of 5 •

m or greater.

32. The method of manufacturing a light emitting device according to claim 29 or claim 30, wherein after the step of die-bonding the method further comprising a step of wire-bonding of electrically connecting a respective portion of the electrically conductive members, which serves as an electrode, and an electrode terminal of the light emitting element by using a wire;

and in the step of applying a filler, the filler is applied to cover a lower portion of the wire.

33. The method of manufacturing a light emitting device according to claim 29 or claim 30, further comprising a step of covering the filler with a light blocking member.