TRANSFER MATERIAL, SUBSTRATE WITH TRANSFER LAYER, TOUCH PANEL, MANUFACTURING METHODS THEREFOR, AND INFORMATION DISPLAY DEVICE

• US 20160039188A1
• Filed: 10/21/2015
• Published: 02/11/2016
• Est. Priority Date: 04/26/2013
• Status: Abandoned Application

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: NAMIKAWA, Hitoshi
• Application Number:
  US14/918,683
• Publication Number:
  US 20160039188A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 23/08 of synthetic resin
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/4026 within the layer by addition of a colorant, e.g. pigments, dyes
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2307/748 Releasability
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 2457/208 Touch screens
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/18 characterised by the use of special additives
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 27/283 comprising polysiloxanes
• CPC Class Codes: B32B 27/32 comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 27/365 comprising polycarbonates
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 7/06 permitting easy separation
• CPC Class Codes: B44C 1/17 Dry transfer
• CPC Class Codes: G06F 2203/04111 : Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/041 : Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/044 : by capacitive means
• CPC Class Codes: G06F 3/0446 : using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

The transfer material includes a temporary support, a release layer, a transfer layer, and a protective film in this order. When the protective film is peeled off from the transfer material, the protective film is peeled off from the transfer layer, and the transfer layer remains on the release layer side. In addition, when the temporary support is peeled off after the transfer layer is transferred to a transfer target substrate which is formed of glass or a film selected from TAC, PET, PC, or COP, the release layer is present on the peeled temporary support side.

Claims

1. A transfer material comprising a temporary support, a release layer, a transfer layer, and a protective film in this order,

wherein when the protective film is peeled off from the transfer material, the protective film is peeled off from the transfer layer and the transfer layer remains on the release layer side, and

when the temporary support is peeled off after the transfer layer is transferred to a transfer target substrate formed of glass or to a transfer target substrate formed of a film selected from triacetyl cellulose, polyethylene terephthalate, polycarbonate, and a cycloolefin polymer, the release layer is peeled off together with the temporary support.

2. The transfer material according to claim 1,

wherein when the protective film is peeled off from the transfer material, a peeling strength between the protective film and the transfer layer is 10 mN/m to 200 mN/m.

3. The transfer material according to claim 1,

wherein when a laminate including the release layer and the temporary support is peeled off from the transfer layer which is transferred to the transfer target substrate, a peeling strength is 40 mN/m to 400 mN/m.

4. The transfer material according to claim 1,

wherein the release layer contains a matting agent, and

the matting agent protrudes from the release layer by 150 nm to 500 nm.

5. The transfer material according to claim 1,

wherein the release layer contains a polymer selected from a polycondensate of alkyl diol and bifunctional or higher isocyanate, a silicone resin, and an olefin resin.

6. The transfer material according to claim 1,

wherein the release layer contains a polymer selected from a polycondensate of alkyl diol and bifunctional or higher isocyanate and an olefin resin.

7. The transfer material according to claim 1,

wherein the transfer layer includes at least one layer, and

at least one layer of the transfer layer contains a binder resin and at least one of a pigment and a dye.

8. The transfer material according to claim 1,

wherein the transfer layer includes at least two layers,

at least one layer of the transfer layer contains a binder resin and at least one of a pigment and a dye, and

another layer of the transfer layer contains a binder resin.

9. The transfer material according to claim 7,

wherein the binder resin contained in the at least one layer of the transfer layer has a siloxane bond.

10. The transfer material according to claim 7,

wherein at least one layer of the transfer layer contains, as the pigment or the dye, at least one pigment or dye selected from a black pigment, a black dye, and a white pigment.

11. The transfer material according to claim 1,

wherein the transfer layer includes at least two layers,

a layer of the transfer layer adjacent to the release layer contains at least one pigment or dye selected from a black pigment and a black dye, and

a layer of the transfer layer adjacent to the protective film contains a white pigment.

12. The transfer material according to claim 1,

wherein the transfer layer includes at least two layers, and

optical densities of the layers of the transfer layer increase toward the release layer.

13. The transfer material according to claim 1,

wherein the transfer layer includes at least two layers, and

an optical density of a layer of the transfer layer adjacent to the release layer is 1.0 to 6.0.

14. The transfer material according to claim 1,

wherein the transfer layer includes at least two layers, and

a thickness of a layer of the transfer layer adjacent to the release layer is 0.5 μ

m to 3.0 μ

m.

15. The transfer material according to claim 1,

wherein the transfer layer includes at least two layers, and

a thickness of a layer of the transfer layer adjacent to the protective film layer is 5.0 μ

m to 50.0 μ

m.

16. The transfer material according to claim 1,

wherein the temporary support contains a resin selected from a polyester resin, a triacyl cellulose resin, and a cycloolefin resin.

17. The transfer material according to claim 1,

wherein the protective film is a polyolefin film.

18. The transfer material according to claim 1,

wherein the transfer target substrate is formed of glass.

19. The transfer material according to claim 1,

wherein the transfer target substrate is formed of a cycloolefin polymer film.

20. A method for manufacturing the transfer material according to claim 1, the method comprising:

(1) preparing the temporary support with the release layer;

(2) forming the transfer layer on the release layer side of the temporary support; and

(3) bonding the protective film to the transfer layer side.

21. A method for manufacturing a substrate with a transfer layer using the transfer material according to claim 1, the method comprising:

(11) peeling off the protective film from the transfer material;

(12) transferring the transfer layer side of the transfer material to the transfer target substrate formed of glass or to the transfer target substrate formed of a film selected from triacetyl cellulose, polyethylene terephthalate, polycarbonate, and a cycloolefin polymer; and

(13) simultaneously peeling off the release layer and the temporary support from the transfer layer.

22. The method for manufacturing a substrate with a transfer layer according to claim 21,

wherein when the transfer layer is transferred to the transfer target substrate, a temperature of the transfer target substrate is 40°

C. to 150°

C.

23. A substrate with a transfer layer which is manufactured using the method for manufacturing a substrate with a transfer layer according to claim 21.

24. The substrate with a transfer layer according to claim 23,

wherein a surface resistance of the transfer layer at 25°

C. is 1.0×

10¹⁰Ω

/□

or higher.

25. A method for manufacturing a touch panel using the substrate with a transfer layer according to claim 23, the method comprising:

(21) forming a conductive layer on the transfer layer side of the substrate with a transfer layer; and

(22) removing a part of the conductive layer to form an electrode pattern.

26. A touch panel comprising the substrate with a transfer layer according to claim 23.

27. An information display device comprising the touch panel according to claim 26.