CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

• US 20160042857A1
• Filed: 03/13/2015
• Published: 02/11/2016
• Est. Priority Date: 08/11/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: CHUN, Byoung Jin, GU, Hyun Hee, HAN, Jae Hwan, SUNG, Woo Kyung, LEE, Young Sook, JEONG, Hye Jin
• Application Number:
  US14/657,845
• Publication Number:
  US 20160042857A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

There are provided a chip electronic component including: a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern, wherein each of the external electrodes includes a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern and a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body.

Claims

1. A chip electronic component comprising:

a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and

external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern,

wherein each of the external electrodes includes;

a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern; and

a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body.

2. The chip electronic component of claim 1, wherein the first plating layer has a thickness of 1 μ

m or more.

3. The chip electronic component of claim 1, wherein the conductive resin layer has a thickness of 20 μ

m or less.

4. The chip electronic component of claim 1, wherein the conductive resin layer contains one or more selected from the group consisting of copper and nickel, and a thermosetting resin.

5. The chip electronic component of claim 1, wherein the magnetic body contains magnetic metal particles and a thermosetting resin.

6. The chip electronic component of claim 5, wherein the magnetic metal particles contain one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni.

7. The chip electronic component of claim 1, wherein the first plating layer is formed of one or more selected from the group consisting of copper and nickel.

8. The chip electronic component of claim 1, further comprising a second plating layer disposed on the conductive resin layer.

9. The chip electronic component of claim 8, wherein the second plating layer includes a nickel (Ni) layer and a tin (Sn) layer which are sequentially disposed.

10. A board having a chip electronic component, the board comprising:

a printed circuit board on which first and second electrode pads are formed; and

the chip electronic component of claim 1, mounted on the printed circuit board.

11. The board of claim 10, wherein the first plating layer has a thickness of 1 μ

m or more.

12. The board of claim 10, wherein the conductive resin layer has a thickness of 20 μ

m or less.

13. The board of claim 10, wherein the conductive resin layer contains one or more selected from the group consisting of copper and nickel, and a thermosetting resin.

14. The board of claim 10, wherein the magnetic body contains magnetic metal particles and a thermosetting resin.

15. The board of claim 14, wherein the magnetic metal particles contain one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni.

16. The board of claim 10, wherein the first plating layer is formed of one or more selected from the group consisting of copper and nickel.

17. The board of claim 10, further comprising a second plating layer disposed on the conductive resin layer.

18. The board of claim 17, wherein the second plating layer includes a nickel (Ni) layer and a tin (Sn) layer which are sequentially disposed.