ELECTRICAL CONNECTION ARRANGEMENT

• US 20160043485A1
• Filed: 08/04/2015
• Published: 02/11/2016
• Est. Priority Date: 08/05/2014
• Status: Active Grant

• Current Assignee: Aptiv Technologies AG (Aptiv PLC)
• Original Assignee: Delphi International Operations Luxembourg SARL (Aptiv PLC)
• Inventors: Stoermer, Peter
• Granted Patent: US 9,620,873 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 12/7088 Arrangements for power supply
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 12/75 connecting to cables except for flat or ribbon cables
• CPC Class Codes: H01R 12/88 acting manually by rotating or pivoting connector housing parts
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/10356 Cables
• CPC Class Codes: H05K 2201/10393 Clamping a component by an element or a set of elements
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB

Abstract

A connection arrangement includes a printed circuit board, a semiconductor component arranged on a first surface, a first side, of the printed circuit board, a connection means arranged on a second surface, a second side, of the printed circuit board, a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.

Claims

1. A connection arrangement comprising:

a printed circuit board;

a semiconductor component arranged on a first surface of a first side of the printed circuit board;

a connection means arranged on a second surface of a second side of the printed circuit board opposite the first surface and the first side; and

a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.

2. The connection arrangement according to claim 1, wherein the connection means is formed from a portion of a second conductive coating of the printed circuit board.

3. The connection arrangement according to claim 1, wherein the semiconductor component and the connection means are arranged spaced apart from an edge of the printed circuit board.

4. The connection arrangement according to claim 1, wherein a second semiconductor component is arranged on the first surface of the first side of the printed circuit board and is directly electrically connected to the contact element.

5. The connection arrangement according to claim 1, wherein the semiconductor component is electrically connected at least with a portion of a conductive coating extending between the semiconductor component and a substrate of the printed circuit board.

6. The connection arrangement according to claim 1, wherein the connection means is formed from a portion of a second conductive coating of the printed circuit board, and an area of the connection means is larger than an area of the conductive coating of the printed circuit board, which is arranged between the semiconductor component and substrate.

7. The connection arrangement according to claim 1, wherein the printed circuit board comprises at least one via in the area between the semiconductor component and the connection means.

8. The connection arrangement according to claim 1, wherein the contact element has a planar surface which is adapted to provide an electrical connection to the connection means.

9. The connection arrangement according to claim 1, wherein the contact element comprises means for cooling.

10. The connection arrangement according to claim 1, wherein the connection arrangement comprises holding means which releasably holds together the contact element and the connection means.

11. The connection arrangement according to claim 10, wherein the holding means is adapted such that upon actuation of the holding means, the contact element is pressed against the connection means and part of the holding means is pressed against the semiconductor component.

12. The connection arrangement according to claim 11 wherein the holding means has a U-shaped cross section and an eccentric is attached to one of the legs which are pivotable into the space between the legs.

13. The connection arrangement according to claim 10, wherein the holding means comprises means for cooling.

14. The connection arrangement according to claim 1, wherein the connection arrangement is suitable for high current applications.

15. The connection arrangement according to claim 1, wherein the electrical line comprises an insulating layer.

16. The connection arrangement according to claim 15, wherein the electrical line comprises a braid with a plurality of wires and the insulating layer encircles the braid.