PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
First Claim
Patent Images
1. A printed circuit board (PCB) assembly comprising:
- a PCB;
an electronic component mounted on the PCB;
a shield can provided to block electromagnetic waves generated by the electronic component; and
a sprayed-on insulating layer provided directly on the shield can to prevent an electrical connection between the electronic component and the shield can.
1 Assignment
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Accused Products
Abstract
A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.
19 Citations
26 Claims
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1. A printed circuit board (PCB) assembly comprising:
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a PCB; an electronic component mounted on the PCB; a shield can provided to block electromagnetic waves generated by the electronic component; and a sprayed-on insulating layer provided directly on the shield can to prevent an electrical connection between the electronic component and the shield can. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A printed circuit board (PCB) assembly, comprising:
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a plurality of electronic components; a PCB on which the plurality of electronic components are mounted; a shield can disposed on the PCB to cover at least one of the plurality of electronic components; and an insulating layer applied, dried, and formed on a portion of the shield can. - View Dependent Claims (15, 16, 17)
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18. A method of manufacturing a printed circuit board (PCB) assembly, the method comprising:
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mounting an electronic component on a PCB; spraying an insulating liquid on one side of a shield can, manufactured in a predetermined shape to block electromagnetic waves of the electronic component, to form an insulating layer; and mounting the shield can with the insulating layer on the PCB with the electronic component. - View Dependent Claims (19, 20, 21, 22, 23)
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24. A shield can, comprising:
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a shielding layer comprising a shielding material having high electrical conductivity to block electromagnetic waves from an electronic component; and an sprayed-on insulating layer comprising an insulating material formed directly on the shielding layer. - View Dependent Claims (25, 26)
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Specification