HEAT DISSIPATING ASSEMBLY

• US 20160047604A1
• Filed: 08/15/2014
• Published: 02/18/2016
• Est. Priority Date: 08/15/2014
• Status: Abandoned Application

• Current Assignee: GE Aviation Systems LLC (GE Aerospace)
• Original Assignee: GE Aviation Systems LLC (GE Aerospace)
• Inventors: Engelhardt, Michel, Swanson, Judd Everett
• Application Number:
  US14/460,655
• Publication Number:
  US 20160047604A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28F 2215/06 Hollow fins; fins with internal circuits
• CPC Class Codes: F28F 2275/20 with threaded elements
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445

Abstract

A heat dissipating assembly includes a substrate configured to support at least one heat producing component and a thermally conductive cooling fin extending from the substrate, wherein heat is conducted away from the heat producing component.

Claims

1. A heat dissipating assembly, comprising:

a substrate configured to support at least one heat producing component;

a thermally conductive cooling fin extending from the substrate; and

a thermally conductive heat pipe conductively coupled to the heat producing component, extending within at least a portion of the cooling fin, and defining a fluid reservoir containing a phase change fluid;

wherein the phase change fluid changes between a liquid and a gas in response to heat conducted from the heat producing component to the heat pipe.

2. The heat dissipating assembly of claim 1 further comprising a plurality of cooling fins and a plurality of heat pipes, wherein each heat pipe extends within at least a portion of a respective cooling fin.

3. The heat dissipating assembly of claim 2 wherein the plurality of cooling fins are arranged in an array.

4. The heat dissipating assembly of claim 1 wherein at least one of the heat pipe or cooling fin is located proximate to the at least one heat producing component.

5. The heat dissipating assembly of claim 1 wherein the heat pipe further comprises mechanical fastener configured to couple with the cooling fin.

6. The heat dissipating assembly of claim 1 wherein the heat pipe further comprises a screw having a threaded exterior surface, wherein the screw is threaded into the cooling fin and the heat pipe is located within the screw.

7. The heat dissipating assembly of claim 6 wherein the screw further comprises an elongated shape having a first end proximate to the substrate and an opposing second end being distal from the substrate.

8. The heat dissipating assembly of claim 7 further comprising a thermally conductive material between the threaded exterior surface of the screw and the cooling fin.

9. The heat dissipating assembly of claim 1 wherein the heat pipe further comprises an elongated shape having a first end proximate to the substrate and an opposing second end being distal from the substrate.

10. The heat dissipating assembly of claim 9 wherein the heat pipe further comprises an inner surface defining the fluid reservoir, wherein the inner surface is configured to provide for capillary action along the elongated shape.

11. The heat dissipating assembly of claim 9 wherein the elongated shape of the heat pipe further comprises a cross section configured to negate gravitational effects on the phase change fluid so that the heat pipe operates in any orientation.

12. The heat dissipating assembly of claim 1 wherein the cooling fin is configured to remove heat from at least one of the heat pipe or substrate by convection.

13. The heat dissipating assembly of claim 12 wherein the cooling fin is exposed to a fluid.

14. The heat dissipating assembly of claim 1 wherein the cooling fin further comprises a coating configured to remove heat from at least one of the heat pipe or substrate by radiation.

15. The heat dissipating assembly of claim 1 wherein the substrate comprises an alloy configured to match the coefficient of thermal expansion of the at least one heat producing component.