Curved Light Sensor

• US 20160050379A1
• Filed: 08/18/2014
• Published: 02/18/2016
• Est. Priority Date: 08/18/2014
• Status: Abandoned Application

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Fan, Xiaofeng, Jiang, Tongbi T.
• Application Number:
  US14/462,032
• Publication Number:
  US 20160050379A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

An optical system can include a curved light sensor and an optical system positioned in front of the curved light sensor. The curved light sensor includes a substrate and a patterned stress film formed over at least surface of the substrate.

Claims

4-1. The curved light sensor as in claim 1, wherein the patterned stress film is formed over the non-light receiving surface.

11. A method for producing a curved light sensor, comprising:

attaching a support wafer to a first surface of a sensor wafer, wherein the sensor wafer includes multiple light sensors and the first surface corresponds to a light receiving surface of the multiple light sensors;

forming a stress film over a second surface of the sensor wafer;

forming a pattern in the stress film over each light sensor; and

removing the support wafer from the first surface of the sensor wafer.

12. The method as in claim 11, further comprising attaching a dicing die attach film over the patterned stress film prior to removing the support wafer.

13. The method as in claim 12, further comprising singulating the light sensors after the support wafer is removed, wherein each light sensor includes a respective patterned stress film between the dicing die attach film and the second surface of the light sensor.

14. The method as in claim 11, further comprising thinning the sensor wafer prior to forming the stress film over the second surface of the sensor wafer.

15. The method as in claim 11, wherein the pattern in the stress film over each light sensor is formed using photolithography.

16. The method as in claim 11, wherein the pattern formed in the stress film over each light sensor comprises an identical pattern over each light sensor.

17. The method as in claim 11, wherein the pattern formed in the stress film over each light sensor comprises at least two different patterns, wherein one pattern is formed over a first portion of the light sensors and another pattern is formed over a second portion of the light sensors.

18. The method as in claim 11, further comprising:

prior to attaching a support wafer to a first surface of a sensor wafer, forming a stress film over the first surface of the sensor wafer; and

forming a pattern in the stress film.

19. The method as in claim 11, wherein the curved light sensor comprises a curved image sensor, and wherein the multiple light sensors comprise multiple image sensors.

20. A method for producing a curved light sensor, comprising:

attaching a dicing tape to a first surface of a sensor wafer, wherein the sensor wafer includes multiple light sensors;

forming a stress film over a second surface of the sensor wafer;

forming a pattern in the stress film over each light sensor; and

singulating the light sensors, wherein each light sensor includes a respective patterned stress film over the second surface of the light sensor.

21. The method as in claim 20, further comprising removing the dicing tape.

22. The method as in claim 20, further comprising thinning the sensor wafer prior to forming the stress film over the second surface of the sensor wafer.

23. The method as in claim 20, wherein the pattern in the stress film is formed using photolithography.

24. The method as in claim 20, wherein the pattern formed in the stress film over each light sensor comprises an identical pattern over each light sensor.

25. The method as in claim 20, wherein the pattern formed in the stress film over each light sensor comprises at least two different patterns, wherein one pattern is formed over a first portion of the light sensors and another pattern is formed over a second portion of the light sensors.

26. The method as in claim 20, further comprising:

prior to attaching a dicing tape to a first surface of a sensor wafer, forming a stress film over the first surface of the sensor wafer; and

forming a pattern in the stress film.

27. The method as in claim 20, wherein the curved light sensor comprises a curved image sensor, and wherein the multiple light sensors comprise multiple image sensors.

28. An optical assembly, comprising:

a curved light sensor, comprising;

a light sensor comprising a light receiving surface and a non-light receiving surface; and

a patterned stress film formed over at least one surface of the light sensor; and

an optical system in optical communication with the curved light sensor, wherein the optical system is configured to optimize light received by the light receiving surface of the light sensor.