PACKAGE FOR PROCESSING SENSED-DATA, SENSED-DATA PROCESSOR, AND SYSTEM FOR PROCESSING SENSED-DATA

• US 20160051197A1
• Filed: 05/04/2015
• Published: 02/25/2016
• Est. Priority Date: 08/20/2014
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: UMEMOTO, Mitsuo, KONG, Yung-Cheol, KIM, Woon-Bae, KIM, Pyoung-Wan, CHO, Kyong-Soon
• Granted Patent: US 10,105,102 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/162 Capsule shaped sensor housings, e.g. for swallowing or implantation
• CPC Class Codes: A61B 2562/166 the sensor is mounted on a specially adapted printed circuit board
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/14503 invasive, e.g. introduced into the body by a catheter or needle or using implanted sensors A61B5/1459, A61B5/1464, A61B5/1473, A61B5/1482, A61B5/14865 take precedence
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/6861 Capsules, e.g. for swallowing or implanting

Abstract

Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

Claims

1. A package for processing sensed-data comprising:

a tube having an open end and a hollow space therein;

a cover configured to close the open end of the tube;

a chip within the hollow space of the tube, and the chip being rolled in one or more turns; and

a strained layer affixed to a surface of the rolled chip.

2. The package according to claim 1, further comprising a fixing part configured to fix the chip in the tube.

3. The package according to claim 2, wherein the chip is spaced apart from an inner surface of the tube.

4. The package according to claim 1, wherein the chip is rolled into the generally cylindrical shape with the strained layer on the interior thereof.

5. The package according to claim 1, wherein the chip is rolled into the generally cylindrical shape with the chip on the interior thereof.

6. The package according to claim 1, further comprising a battery coupled to the chip.

7. The package according to claim 1, further comprising a sensor coupled to the chip.

8. The package according to claim 1, wherein the chip comprises a wireless communication circuit.

9. A sensed-data processor comprising:

a flex circuit with a strained layer affixed to a surface thereof to produce a laminar flex circuit structure, the flex circuit comprising a bio-sensor part, a data processor part coupled with the sensor part, and a wireless communication part coupled with the data processor part,

wherein the laminar flex circuit structure is rolled in one or more turns.

10. The processor according to claim 9, wherein the strained layer is affixed to a circuit layer of the flex circuit.

11. The processor according to claim 9, wherein the strained layer is affixed to a rear surface of the flex circuit.

12. The processor according to claim 9, wherein the strained layer comprises at least one compound selected from SiO, SiOH, SiN, SiON, SiHN, AlO, or ZrO, and wherein the strained layer has a thickness of about 1 to about 3 μ

m.

13. The processor according to claim 9, wherein the strained layer comprises Si, and wherein the strained layer has a thickness of about 3 to about 10 μ

m.

14. The processor according to claim 9, wherein the flex circuit has a thickness of about 3 to about 10 μ

m.

15. The processor according to claim 9, wherein the flex circuit comprises a system on chip (SoC).

16. The processor according to claim 9, wherein the flex circuit further comprises a power generation part, a control part and a memory part.

17. A system for processing sensed-data within a body, the system comprising:

a body-implantable package for processing sensed-data, the package comprising;

a flexible circuit layer having a flexible strained layer affixed thereto,

the circuit layer and the strained layer being rolled into a curl-biased circuit layer having one or more turns,

the curl-biased circuit layer including a circuit comprising a sensor means, a power generation means, a control means, and a wireless communication means, and

a close-able tube sealingly containing the tubular circuit; and

a device configured to be external to a package-implanted body, the external device configured to receive processed-sensed data transmitted by the wireless communication means.

18. The system of claim 17, wherein the system further comprises:

plural ones of the body-implantable packages configured to be implanted within the same body.

19. The system of claim 18, wherein the system further comprises:

a repeater operatively coupled between the plural body-implantable packages and the external device.

20. The system of claim 17, wherein the rolling of the circuit layer and the strained layer occurs automatically as a result of manufacturing process steps comprising:

dicing a wafer bearing plural ones of the circuit layers and their respective strained layers into individuated chips, and

melting an adhesive layer between the wafer and a substrate to separate the wafer from the substrate,

wherein the dicing and melting steps release the curl-biased circuit layer and the strained layer as a unit to roll in one or more turns into a generally cylindrical shape.