LIGHT EMITTING ELEMENT PACKAGE

• US 20160056345A1
• Filed: 03/25/2014
• Published: 02/25/2016
• Est. Priority Date: 03/25/2013
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: PARK, In Yong, LEE, Gun Kyo, LEE, Jong Woo, LEE, Ju Young, CHO, Yun Min
• Granted Patent: US 10,177,286 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/195 Details of lamp holders, terminals or connectors
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/0756 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-μm distance in the horizontal direction.

Claims

1. A light emitting element package comprising:

a circuit board unit including a first region and second regions, a height of the second regions is different from that of the first region, the second regions including a (2-1)^th region and a (2-2)^th region being opposite each other across the first region; and

at least one light emitting element disposed in each of the first region and the second regions,

wherein output of the light emitting element disposed in the first region is greater than output of the light emitting elements disposed in the second regions.

2. The light emitting element package according to claim 1, wherein, in the circuit board unit, a first circuit board of the first region and second circuit boards of the second regions contact each other.

3. The light emitting element package according to claim 1, wherein the height of the second regions is greater than the height of the first region.

4. The light emitting element package according to claim 1, wherein two rows of light emitting elements are disposed in the first region so as to be separated from each other by 50 μ

m to 100 μ

m.

5. The light emitting element package according to claim 1, wherein the light emitting element in the first region and the light emitting element in the second region, disposed adjacent to each other, are disposed by a distance of greater than 0 μ

m and less than 100 μ

m in the horizontal direction.

6. The light emitting element package according to claim 1, wherein one to two rows of light emitting elements are disposed in the first region and one row of light emitting elements is disposed in each of the (2-1)^th region and the (2-2)^th region.

7. The light emitting element package according to claim 1, further comprising a phosphor layer disposed on the respective light emitting elements.

8. The light emitting element package according to claim 7, wherein the height of the respective light emitting elements is 90 μ

m to 100 μ

m and the height of the phosphor layer is 50 μ

m to 60 μ

m.

9. The light emitting element package according to claim 1, wherein the respective light emitting elements are disposed by a distance of within 100 μ

m in the horizontal direction.

10. The light emitting element package according to claim 1, wherein the circuit board unit further includes third regions disposed at a greater height than that of the second regions, the third regions include a (3-1)^th region and a (3-2)^th region being opposite each other across the second regions, and at least one light emitting element is disposed in each of the (3-1)^th region and the (3-2)^th region.

11. The light emitting element package according to claim 10, wherein the light emitting element in the third region is disposed by a distance of within 100 μ

m in the horizontal direction from the light emitting element in the second region.

12. The light emitting element package according to claim 10, wherein the light emitting element in the second region and the light emitting element in the third region, disposed adjacent to each other, are disposed by a distance of greater than 0 μ

m and less than 100 μ

m in the horizontal direction.

13. The light emitting element package according to claim 10, wherein a height difference between the bottom surfaces of the second regions and the bottom surfaces of the third regions is 160 μ

m to 5 mm.

14. The light emitting element package according to claim 10, wherein output of the light emitting elements disposed in the second regions is greater than output of the light emitting elements disposed in the third regions.

15. The light emitting element package according to claim 1, wherein a height difference between the bottom surfaces of the first regions and the bottom surfaces of the second regions is 160 μ

m to 5 mm.

16. A light emitting element package comprising:

a circuit board unit including a first region, second regions having a greater height than that of the first region, and third regions disposed at a greater height than that of the second regions, the second regions including a (2-1)^th region and a (2-2)^th region being opposite each other across the first region and the third regions include a (3-1)^th region and a (3-2)^th region being opposite each other across the second regions; and

at least one light emitting element disposed in each of the first region, a (2-1)^th region, a (2-2)^th region, a (3-1)^th region and a (3-2)^th region.

17. The light emitting element package according to claim 16, wherein a height difference between the first region and the second regions is equal to a height difference between the second regions and the third regions.

18. The light emitting element package according to claim 16, wherein a pair of second regions is disposed opposite each other across the first region so as to be symmetrical to each other.

19. The light emitting element package according to claim 18, wherein the light emitting elements respectively disposed in the pair of second regions are disposed so as to be symmetrical to each other with respect to the first region.

20. A light emitting element package comprising:

a circuit board unit including a first region, second regions, and third regions, the second regions is disposed at a greater height than that of the first region, and the third regions is disposed at a greater height than that of the second regions; and

at least one light emitting element disposed in each of the first region, the second regions and the third regions,

wherein output of the light emitting element disposed in the first region is greater than output of the light emitting elements disposed in the second regions, and output of the light emitting element disposed in the second region is greater than output of the light emitting elements disposed in the third regions.