Parametric transducer headphones

• US 20160057529A1
• Filed: 04/27/2015
• Published: 02/25/2016
• Est. Priority Date: 08/20/2014
• Status: Abandoned Application

• Current Assignee: Turtle Beach Corporation
• Original Assignee: Turtle Beach Corporation
• Inventors: Kappus, Brian Alan, Norris, Elwood Grant, Barnes, James A.
• Application Number:
  US14/545,351
• Publication Number:
  US 20160057529A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H04R 1/1008 Earpieces of the supra-aural or circum-aural type
• CPC Class Codes: H04R 1/1058 Manufacture or assembly
• CPC Class Codes: H04R 1/1075 Mountings of transducers in earphones or headphones
• CPC Class Codes: H04R 15/00 Magnetostrictive transducers magnetostrictive elements in general H10N30/00
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 2217/03 Parametric transducers where sound is generated or captured by the acoustic demodulation of amplitude modulated ultrasonic waves

Abstract

An ultrasonic audio headphone system includes two ultrasonic speakers, each having a backing plate and a flexible layer disposed adjacent the backing plate. The backing plate and the flexible layer are each configured to be electrically coupled to a respective one of a pair of signal lines carrying the audio modulated ultrasonic carrier signal from the amplifier, wherein upon application of the audio modulated ultrasonic carrier signal, the flexible layer is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air. The ultrasonic audio headphone system can further include a frequency mismatched microphone to avoid feedback when the microphone and the ultrasonic speakers are, e.g., proximately located.

Claims

1. An ultrasonic headphone system, comprising:

two ultrasonic audio speakers, each comprising;

a backing plate; and

a flexible layer disposed adjacent the backing plate, the backing plate and the flexible layer each configured to be electrically coupled to a respective one of a pair of signal lines carrying the audio modulated ultrasonic carrier signal from an amplifier, wherein upon application of the audio modulated ultrasonic carrier signal, the flexible layer is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air; and

two headphone housings, each of the headphone housings holding one of the two ultrasonic audio speakers and configured to provide vented engagement of each of the headphone housings with an ear.

2. The ultrasonic headphone system of claim 1, wherein each of the two ultrasonic audio speakers comprises either an electrostatic emitter, a piezoelectric film emitter, a piezocrystal emitter, a multiple stack piezoelectric emitter, or a magnetostrictive emitter.

3. The ultrasonic headphone system of claim 1, wherein each of the two ultrasonic audio speakers operatively provides at least a 5 dB increase in sensitivity to perceptible audio tones within a range of about 2 kHz to 16 kHz.

4. The ultrasonic headphone system of claim 1, wherein each of the two ultrasonic audio speakers renders audio reproduced from the audio modulated ultrasonic carrier signal having a frequency of at least 30 Hz audible.

5. The ultrasonic headphone system of claim 1, wherein an audio signal utilized to generate the audio modulated ultrasonic carrier signal is generated by a proximately-located microphone.

6. The ultrasonic headphone system of claim 5, wherein the microphone comprises an ultrasonic-insensitive microphone.

7. The ultrasonic headphone system of claim 6, wherein the microphone comprises a mechanically filtered microphone adapted to attenuate or filter out an ultrasonic component of the audio modulated ultrasonic carrier signal.

8. The ultrasonic headphone system of claim 6, wherein the microphone comprises an electrically filtered microphone adapted to filter signals approximately at or higher than 15 kHz.

9. An ultrasonic headphone system, comprising:

an amplifier;

two headphone earpiece housings;

first and second ultrasonic audio speakers, each mounted in a respective one of the earpiece housings and each comprising;

a backing plate; and

a flexible layer disposed adjacent the backing plate, the backing plate and the flexible layer each configured to be electrically coupled to a respective one of a pair of signal lines carrying the audio modulated ultrasonic carrier signal from the amplifier, wherein upon application of the audio modulated ultrasonic carrier signal, the flexible layer is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air;

a signal processing module for equalizing, compressing, filtering, and first and second audio signals and modulating the audio signals onto respective ultrasonic carriers; and

at least one microphone substantially insensitive to ultrasonic signals including at least an ultrasonic component of the audio modulated ultrasonic carrier signal.

10. The ultrasonic headphone system of claim 9, wherein each of the first and second ultrasonic audio speakers comprises an electrostatic emitter, a piezoelectric film emitter, a piezocrystal emitter, a multiple stack piezoelectric emitter, or a magnetostrictive emitter.

11. The ultrasonic headphone system of claim 9, wherein each of the first and second ultrasonic audio speakers renders audio reproduced from the audio modulated ultrasonic carrier signal having a frequency of at least 30 Hz audible.

12. The ultrasonic headphone system of claim 9, wherein the at least one microphone comprises a mechanically filtered microphone adapted to attenuate or filter out an ultrasonic component of the audio modulated ultrasonic carrier signal.

13. The ultrasonic headphone system of claim 9, wherein the at least one microphone comprises an electrically filtered microphone adapted to filter signals approximately at or higher than 15 kHz.

14. Ultrasonic headphones, comprising:

two headphone earpiece housings, each configured to provide an air-gapped engagement with respective ears of a listener;

first and second ultrasonic audio speakers, each mounted in a respective one of the earpiece housings and each comprising;

a backing plate; and

a flexible layer disposed adjacent the backing plate, the backing plate and the flexible layer each configured to be electrically coupled to a respective one of a pair of signal lines carrying an audio modulated ultrasonic carrier signal from an amplifier, wherein upon application of the audio modulated ultrasonic carrier signal, the flexible layer is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air,

wherein each of the first and second ultrasonic audio speakers renders audio reproduced from the audio modulated ultrasonic carrier signal having a frequency of at least 30 Hz audible.

15. The ultrasonic headphones of claim 14, wherein the audio signal is generated by a proximately-located microphone.

16. The ultrasonic headphones of claim 15, wherein the microphone comprises a mechanically filtered microphone adapted to attenuate or filter out an ultrasonic component of the audio modulated ultrasonic carrier signal.

17. The ultrasonic headphones of claim 15, wherein the microphone comprises an electrically filtered microphone adapted to filter signals approximately at or higher than 15 kHz.

18. Ultrasonic headphones, comprising:

two headphone earpiece housings;

a first set of audio speakers mounted in each of the earpiece housings, wherein each of the first set of audio speakers renders audio reproduced from the audio modulated ultrasonic carrier signal having a frequency of at least 30 Hz audible, and further wherein each of the first set of audio speakers comprises;

a backing plate; and

a flexible layer disposed adjacent the backing plate, the backing plate and the flexible layer each configured to be electrically coupled to a respective one of a pair of signal lines carrying an audio modulated ultrasonic carrier signal from an amplifier, wherein upon application of the audio modulated ultrasonic carrier signal, the flexible layer is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air; and

a second set of audio speakers mounted in each of the earpiece housings.

19. The ultrasonic headphones of claim 18, wherein each of the second set of audio speakers comprises a dynamic loudspeaker.

20. The ultrasonic headphones of claim 18, wherein the audio signal is generated by a proximately-located microphone.

21. The ultrasonic headphones of claim 20, wherein the microphone comprises a mechanically filtered microphone adapted to attenuate or filter out an ultrasonic component of the audio modulated ultrasonic carrier signal.

22. The ultrasonic headphones of claim 20, wherein the microphone comprises an electrically filtered microphone adapted to filter signals approximately at or higher than 15 kHz.

23. An ultrasonic headphone system, comprising:

two headphone earpiece housings;

a first set of audio speakers mounted in each of the earpiece housings, each comprising;

a backing plate; and

a flexible layer disposed adjacent the backing plate, the backing plate and the flexible layer each configured to be electrically coupled to a respective one of a pair of signal lines carrying an audio modulated ultrasonic carrier signal from an amplifier and driven directly by a voice coil such that the flexible layer is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air;

a second set of audio speakers mounted in each of the earpiece housings; and

a microphone substantially insensitive to ultrasonic signals including at least an ultrasonic component of the audio modulated ultrasonic carrier signal and substantially capable of sensing an audio component of the audio modulated ultrasonic carrier signal.

24. The ultrasonic headphone system of claim 23, wherein each of the second set of audio speakers comprises a dynamic loudspeaker.

25. An ultrasonic headphone system, comprising:

an amplifier;

two headphone earpiece housings;

first and second ultrasonic audio speakers, each mounted in a respective one of the earpiece housings and each comprising;

a backing plate; and

a flexible layer disposed adjacent the backing plate, the backing plate and the flexible layer each configured to be electrically coupled to a respective one of a pair of signal lines carrying the audio modulated ultrasonic carrier signal from the amplifier, wherein upon application of the audio modulated ultrasonic carrier signal, the flexible layer is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air;

a signal processing module for equalizing, compressing, filtering, and first and second audio signals and modulating the audio signals onto respective ultrasonic carriers; and

at least one microphone substantially insensitive to ultrasonic signals including at least an ultrasonic component of the audio modulated ultrasonic carrier signal, wherein at least 40 dB audio isolation is provided between the first and second ultrasonic audio speakers and the at least one microphone.