METHOD OF PRODUCING SUSPENSION BOARD WITH CIRCUIT

• US 20160057867A1
• Filed: 06/29/2015
• Published: 02/25/2016
• Est. Priority Date: 08/21/2014
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: YAMAUCHI, Daisuke, SAKAKURA, Takatoshi
• Granted Patent: US 10,225,930 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G11B 5/484 Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2203/0323 Working metal substrate or core, e.g. by etching, deforming
• CPC Class Codes: H05K 3/0082 characterised by the exposure method of radiation-sensitive masks
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: H05K 3/064 Photoresists
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence

Abstract

A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer; forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.

Claims

1. A method of producing a suspension board with circuit, comprising the steps of:

preparing a metal supporting layer;

forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer;

curing the curable insulating layer to form an insulating layer;

subjecting the metal supporting layer exposed from the opening to microwave plasma treatment; and

forming a metal conducting portion on the metal supporting layer exposed from the opening.

2. A method of producing a suspension board with circuit according to claim 1, wherein the step of forming the curable insulating layer is performed by applying a solution containing the photosensitive curable insulating composition onto the meal supporting layer and developing the applied solution.

3. A method of producing a suspension board with circuit according to claim 1, wherein a gas used for the microwave plasma treatment contains an inert gas.

4. A method of producing a suspension board with circuit according to claim 1, wherein the metal conducting portion is electrically connected to differential signal wires.

5. A method of producing a suspension board with circuit according to claim 4, wherein

a plurality of the openings and a plurality of the metal conducting portions are formed, and

the plurality of metal conducting portions are electrically connected to each other via the metal supporting layer.