ELECTRONIC DEVICE, OPTICAL MODULE AND MANUFACTURING PROCESS THEREOF

• US 20160061653A1
• Filed: 08/25/2015
• Published: 03/03/2016
• Est. Priority Date: 08/26/2014
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Chen, Ying-Chung, Chang, Jung-Hsuan, Shih, Chao-Lin
• Granted Patent: US 11,264,367 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01J 1/0209 Monolithic
• CPC Class Codes: G01S 17/04 Systems determining the presence of a target
• CPC Class Codes: G01S 7/4813 Housing arrangements
• CPC Class Codes: G06F 1/3231 Monitoring the presence, absence or movement of users
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14678 : Contact-type imagers
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 31/167 : the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: Y02D 10/00 : Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The present disclosure relates to an optical module, including: a carrier, a emitter, a detector and an encapsulant. The carrier has a first surface. The emitter is disposed above the first surface. The detector is disposed above the first surface. The encapsulant is disposed on the first surface and exposes at least a portion of the emitter.

Claims

1. An optical module, comprising:

a carrier having a first surface;

an emitter disposed above the first surface;

a detector disposed above the first surface; and

an encapsulant disposed on the first surface and exposing at least a portion of the emitter.

2. The optical module according to claim 1, wherein the encapsulant at least laterally surrounds the detector, and exposes at least a portion of the detector.

3. The optical module according to claim 1, wherein the encapsulant is opaque.

4. The optical module according to claim 3, further comprising at least one conductive wire, the conductive wire electrically connecting the emitter to the carrier, wherein the encapsulant covers at least a portion of the emitter and the conductive wire.

5. The optical module according to claim 4, wherein the encapsulant further covers at least a portion of the detector.

6. The optical module according to claim 3, wherein at least one edge of the encapsulant includes a chamfering.

7. The optical module according to claim 3, wherein the emitter is a flip-chip type die.

8. The optical module according to claim 1, wherein the emitter is a vertical-cavity surface-emitting laser.

9. An electronic device, comprising:

an optical module, comprising;

a carrier having a first surface;

an emitter disposed above the first surface;

a detector disposed above the first surface; and

an encapsulant covering at least a portion of the emitter at a side of the emitter facing the detector; and

a light-transmitting plate disposed above the optical module.

10. The electronic device according to claim 9, wherein the encapsulant at least laterally surrounds at least a portion of the detector, and exposes at least a portion of the detector.

11. The electronic device according to claim 9, wherein the encapsulant is opaque.

12. The electronic device according to claim 9, wherein the encapsulant transmits light.

13. The electronic device according to claim 9, wherein the encapsulant exposes a portion of the emitter, and the exposed portion of the emitter has a first edge and a second edge, the second edge is opposite to the first edge, and a distance between the second edge and the detector is less than a distance between the first edge and the detector, and wherein the side of the emitter facing the detector is the second edge;

wherein the encapsulant further exposes a portion of the detection, and the exposed portion of the detector further comprises a photosensitive region, the photosensitive region has a third edge and a fourth edge, the fourth edge is opposite to the third edge, and a distance between the fourth edge and the emitter is greater than a distance between the third edge and the emitter;

wherein the light-transmitting plate has a second surface and a third surface, and a distance between the third surface and the carrier is greater than a distance between the second surface and the carrier;

wherein the emitter is configured to emit light to be incident on the light-transmitting plate at an incident angle θ

₁, the maximum value of the incident angle θ

₁ is a critical value θ

_th, the critical value θ

_th meets a first equation n₁ sin θ

_th=n₂ sin θ

₂ and a second equation;

D=(h_eg+h_dg)tan θ

_th+2h_g tan θ

₂, wherein n₁ is a refractive index of an intermediate medium disposed between the first surface and the light-transmitting plate, n₂ is an refractive index of the light-transmitting plate, θ

₂ is a first refraction angle generated by the first light when entering into the light-transmitting plate at an incident angle of the critical value θ

_th, D is a distance between the first edge and the third edge, heg is a distance between an upper surface of the emitter and the second surface of the light-transmitting plate, hdg is a distance between an upper surface of the photosensitive region and the second surface of the light-transmitting plate, and hg is a thickness between the second surface and the third surface of the light-transmitting plate.

14. The electronic device according to claim 13, wherein the encapsulant is configured to block light emitted from the emitter and having an incident angle of greater than or equal to the critical value θ

_th from entering the light-transmitting plate.

15. The electronic device according to claim 14, wherein the emitter has a first thickness h1, the first edge and the second edge are spaced apart from each other at a first distance W, the encapsulant adjacent to the second edge has a second thickness at the second edge, the second thickness is greater than a minimum thickness value hmin, a difference between the minimum thickness value hmin and the first thickness h1 of the emitter is h2, and h2 meets the following equation:

h2=W cot θ

_th.

16. The electronic device according to claim 13, wherein the critical value θ

_th is 25.7 degrees.

17. The electronic device according to claim 13, wherein the emitter is a vertical-cavity surface-emitting laser.

18. A process for manufacturing an optical module, comprising:

(a) providing a carrier, the carrier having a first surface;

(b) disposing an emitter above the first surface;

(c) disposing a detector above the first surface; and

(d) applying an encapsulant to at least laterally surround the emitter, and expose at least a portion of the emitter.

19. The process for manufacturing an optical module according to claim 18, further comprising applying the encapsulant to at least laterally surround the detector, and expose at least a portion of the detector.

20. The process for manufacturing an optical module according to claim 18, further comprising connecting the emitter to the carrier using at least one conductive wire, wherein the encapsulant, when applied, covers at least a portion of the conductive wire.