ADAPTIVE LOADING AND COOLING

• US 20160062373A1
• Filed: 08/29/2014
• Published: 03/03/2016
• Est. Priority Date: 08/29/2014
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: King, Jeffrey Howard
• Application Number:
  US14/473,883
• Publication Number:
  US 20160062373A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G05B 15/02 electric
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20836 Thermal management, e.g. server temperature control
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

Apparatuses, methods and storage media associated with preferential loading of nodes of an electronic device are disclosed herein. In embodiments, a controller may identify a first node that is upstream of a second node. The controller may preferentially assign workload to the first node before assigning workload to the second node. Finally, the controller may alter a cooling rate of the cooling device based on the assignment of workload. Other embodiments may be described and/or claimed.

Claims

1. An apparatus comprising:

identification circuitry to identify, based on an airstream of a cooling device, a first node in a plurality of nodes that is upstream of a second node in the plurality of nodes;

assignment circuitry coupled with the identification circuitry, the assignment circuitry to preferentially assign workload to the first node before assigning workload to the second node; and

cooling circuitry coupled with the assignment circuitry, the cooling circuitry to alter a cooling rate of the cooling device based on an assignment of workload to the first node.

2. The apparatus of claim 1, wherein the cooling device is a cooling fan configured to cool the plurality of nodes with the airstream.

3. The apparatus of claim 1, wherein the plurality of nodes includes a matrix of nodes that includes at least two rows of nodes and at least two columns of nodes, and wherein the first node is in a first row of nodes and the second node is in a second row of nodes that is downstream from the first row of nodes.

4. The apparatus of claim 3, wherein the identification circuitry is further to identify a third node in the first row of nodes;

and

the assignment circuitry is further to assign workload to the third node before assigning workload to the second node.

5. The apparatus of claim 1, wherein a node in the plurality of nodes is a microserver, a system on a chip (SoC), or a central processing unit (CPU).

6. The apparatus of claim 1, wherein the cooling circuitry is to decrease a cooling rate of the cooling device based on an assignment of workload to the first node.

7. The apparatus of claim 6, wherein the cooling circuitry is to increase the cooling rate of the cooling device based on an assignment of workload to the first node and the second node.

8. An electronic device comprising:

a cooling device;

a plurality of nodes thermally configured to be cooled by the cooling device, wherein a first node in the plurality of nodes is upstream of a second node in the plurality of nodes; and

a controller coupled with the plurality of nodes and the cooling device, the controller to preferentially assign workload to the first node before assigning workload to the second node.

9. The electronic device of claim 8, wherein the controller is further to alter a cooling rate of the cooling device based on an amount of workload assigned to the first node.

10. The electronic device of claim 8, wherein the cooling device includes a plurality of cooling fans.

11. The electronic device of claim 8, wherein the plurality of nodes includes a matrix of nodes that includes at least two rows of nodes and at least two columns of nodes, and wherein the first node is in a first row of nodes and the second node is in a second row of nodes that is downstream of the first row of nodes.

12. The electronic device of claim 11, wherein the controller is further configured to assign workload to a third node in the first row of nodes before assigning workload to the second node.

13. The electronic device of claim 11, wherein a node in the plurality of nodes is a microserver, a system on a chip (SoC), or a central processing unit (CPU).

14. One or more non-transitory computer-readable media comprising instructions that cause a controller, in response to execution of the instructions by the controller, to:

identify a first node in a plurality of nodes that is upstream of a second node in the plurality of nodes in relation to an airstream of a cooling device; and

assign, based on a result of the identify, workload to the first node prior to assigning workload to the second node.

15. The one or more non-transitory computer-readable media of claim 14, wherein the controller is further caused to decrease a cooling rate of the cooling device based on an assignment of workload to the first node.

16. The one or more non-transitory computer-readable media of claim 15, wherein the controller is further caused to increase the cooling rate of the cooling device based on an assignment of workload to the first node and the second node.

17. The one or more non-transitory computer-readable media of claim 14, wherein the cooling device is a cooling fan configured to cool at least a node of the plurality of nodes with the airstream.

18. The one or more non-transitory computer-readable media of claim 14, wherein the plurality of nodes includes a matrix of nodes that includes at least two rows of nodes and at least two columns of nodes, and wherein the first node is in a first row of nodes and the second node is in a second row of nodes that is downstream from the first row of nodes in relation to the airstream.

19. The one or more non-transitory computer-readable media of claim 18, wherein the controller is further caused to assign workload to a third node in the first row of nodes before assigning workload to the second node.

20. The one or more non-transitory computer-readable media of claim 14, wherein a node in the plurality of nodes is a microserver, a system on a chip (SoC), or a central processing unit (CPU).

21. A method comprising:

identifying, by a controller, a first node in a plurality of nodes that is upstream in an airstream of a cooling device with respect to a second node in the plurality of nodes;

assigning, by the controller and based on the identification, workload to the first node prior to assigning workload to the second node; and

altering, by the controller and based on the assigning, a cooling rate of the cooling device.

22. The method of claim 21, further comprising altering, by the controller, the cooling rate of the cooling device to a first setting if the workload is only assigned to the first node;

and altering, by the controller, the cooling rate of the cooling device to a second setting if the workload is assigned to the first node and the second node.

23. The method of claim 21, wherein the plurality of nodes includes a matrix of nodes that includes at least two rows of nodes and at least two columns of nodes, and wherein the first node is in a first row of nodes and the second node is in a second row of nodes that is downstream from the first row of nodes in the airstream of the cooling device.

24. The method of claim 23, further comprising assigning workload to a third node in the first row of nodes before assigning workload to the second node.

25. The method of claim 21, wherein a node in the plurality of nodes is a microserver, a system on a chip (SoC), or a central processing unit (CPU).