MAGNETICALLY DOPED ADHESIVE FOR ENHANCING MAGNETIC COUPLING

• US 20160064141A1
• Filed: 09/02/2015
• Published: 03/03/2016
• Est. Priority Date: 09/02/2014
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Graham, Christopher S., Thompson, Paul J., Jol, Eric S., Golko, Albert J., Yao, Stephen E., Brzezinski, Makiko K., Larsson, Karl Ruben F., Mosy, John S.
• Granted Patent: US 10,699,842 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 1/26 by macromolecular organic substances
• CPC Class Codes: H01F 1/37 in a bonding agent
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/366 made of ferromagnetic material
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10

Abstract

In some embodiments, an electronic device includes an electronic component that is at least partially encapsulated by an adhesive doped with soft magnetic material that functions as an EMI shield for the electronic component. In various embodiments, an electronic device includes a first magnetic component separated from a second magnetic component by a gap within which is positioned an adhesive doped with soft magnetic material. The doped adhesive is positioned in a magnetic path between the first and second magnetic components and aids in magnetically coupling the first and second magnetic components and/or guides magnetic flux between the first and second magnetic components.

Claims

1. An electronic device, comprising:

an electronic component; and

an adhesive doped with soft magnetic material encapsulating at least part of the electronic component;

wherein

the adhesive functions as an electromagnetic interference shield for the electronic component.

2. The electronic device of claim 1, wherein the adhesive is tuned for at least one of an electromagnetic interference level or electromagnetic interference frequency range based on an amount of the soft magnetic material, a particle size of the soft magnetic material, or a content of the soft magnetic material.

3. The electronic device of claim 1, wherein the adhesive forms a barrier that protects the electronic component from contaminants.

4. The electronic device of claim 1, wherein the adhesive is nonconductive.

5. The electronic device of claim 1, wherein particles of the soft magnetic material are coated.

6. The electronic device of claim 1, wherein:

the soft magnetic material comprises at least one of a ferrite material, carbonyl iron, iron, nickel, cobalt, an iron alloy, a nickel alloy, or a cobalt alloy; and

the adhesive comprises at least one of epoxy, polyurethane, hot melt, pressure sensitive adhesive, or glue.

7. The electronic device of claim 1, wherein the electronic component comprises at least one of a printed circuit board or a component of an inductive power transmission system.

8. The electronic device of claim 1, wherein the adhesive is bonded to the electronic component.

9. The electronic device of claim 8, wherein:

the adhesive is positioned within a gap between the electronic component and the magnetic component;

a magnetic field passes through the gap; and

the adhesive aids in magnetically coupling the electronic component to the magnetic component.

10. An electronic device, comprising:

a first magnetic component that is separated from a second magnetic component by a gap; and

an adhesive doped with soft magnetic material positioned within the gap in a magnetic path between the first magnetic component and the second magnetic component.

11. The system of claim 10, wherein the adhesive aids in magnetically coupling the first magnetic component to the second magnetic component.

12. The system of claim 10, wherein the adhesive guides magnetic flux between the first magnetic component and the second magnetic component.

13. The system of claim 10, wherein the adhesive is also positioned in an additional gap between the first magnetic component and a nonmagnetic component.

14. The system of claim 10, wherein the soft magnetic material comprises insulated soft magnetic material.

15. The system of claim 10, wherein the first magnetic component is part of an inductive power transmission system.

16. The system of claim 10, wherein the adhesive has a higher magnetic permeability than air.

17. A method for reducing electromagnetic interference, comprising:

doping an adhesive with soft magnetic material; and

encapsulating at least part of an electronic component with the doped adhesive;

wherein

the doped adhesive functions as an electromagnetic interference shield for the electronic component.

18. The method of claim 17, further comprising positioning the doped adhesive within a gap between a first magnetic component and a housing encompassing the first magnetic component.

19. The method of claim 18, wherein the doped adhesive enhances a magnetic field associated with the first magnetic component.

20. The method of claim 17, further comprising filling an air gap with the doped adhesive.