ORGANIC LIGHT EMITTING DISPLAY APPARATUS ENCAPSULATED WITH HYDROPHOBIC ORGANIC FILM AND MANUFACTURING METHOD THEREOF
First Claim
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1. A method for manufacturing an organic light emitting display apparatus, comprising:
- providing a substrate;
forming an organic light emitting unit on the substrate; and
forming a film encapsulation layer covering the organic light emitting unit,wherein forming the film encapsulation layer comprises;
forming at least a hydrophobic organic layer covering the organic light emitting unit with a plasma enhanced chemical vapor deposition method, wherein the film encapsulation layer comprises the hydrophobic organic layer, and wherein the hydrophobic organic layer is disposed at an outermost portion of the film encapsulation layer,wherein the hydrophobic organic layer comprises a fluorinated hybrid polymer organic film, and the fluorinated hybrid polymer organic film comprises, in atomic percent, 10 at % to 50 at % of fluorine atom F, 1 at % to 30 at % of silicon atom Si, 1 at % to 30 at % of oxygen atom O, and 15 at % to 50 at % of carbon atom C.
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Abstract
An organic light emitting display apparatus is disclosed. The display apparatus includes a substrate, an organic light emitting unit on the substrate, and a film encapsulation layer on the organic light emitting unit. The film encapsulation layer includes a hydrophobic organic layer disposed at an outermost portion of the film encapsulation layer.
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Citations
14 Claims
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1. A method for manufacturing an organic light emitting display apparatus, comprising:
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providing a substrate; forming an organic light emitting unit on the substrate; and forming a film encapsulation layer covering the organic light emitting unit, wherein forming the film encapsulation layer comprises; forming at least a hydrophobic organic layer covering the organic light emitting unit with a plasma enhanced chemical vapor deposition method, wherein the film encapsulation layer comprises the hydrophobic organic layer, and wherein the hydrophobic organic layer is disposed at an outermost portion of the film encapsulation layer, wherein the hydrophobic organic layer comprises a fluorinated hybrid polymer organic film, and the fluorinated hybrid polymer organic film comprises, in atomic percent, 10 at % to 50 at % of fluorine atom F, 1 at % to 30 at % of silicon atom Si, 1 at % to 30 at % of oxygen atom O, and 15 at % to 50 at % of carbon atom C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification