ORGANIC LIGHT EMITTING DISPLAY APPARATUS ENCAPSULATED WITH HYDROPHOBIC ORGANIC FILM AND MANUFACTURING METHOD THEREOF

• US 20160064689A1
• Filed: 11/11/2015
• Published: 03/03/2016
• Est. Priority Date: 12/18/2013
• Status: Active Grant

• Current Assignee: Tianma Microelectronics Company Limited, Wuhan Tianma Micro-Electronics Company Limited (Wuhan Donghu New Technology Development Zone Production Promotion Centre), Wuhan Tianma Microelectronics Company Limited Shanghai Branch
• Original Assignee: Shanghai Tianma AM-OLED Co. Ltd (Tianma Microelectronics Company Limited), Tianma Microelectronics Company Limited
• Inventors: Xie, Zaifeng
• Granted Patent: US 9,391,298 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 85/10 Organic polymers or oligomers
• CPC Class Codes: H10K 85/40 Organosilicon compounds, e.g. TIPS pentacene

Abstract

An organic light emitting display apparatus is disclosed. The display apparatus includes a substrate, an organic light emitting unit on the substrate, and a film encapsulation layer on the organic light emitting unit. The film encapsulation layer includes a hydrophobic organic layer disposed at an outermost portion of the film encapsulation layer.

Claims

1. A method for manufacturing an organic light emitting display apparatus, comprising:

providing a substrate;

forming an organic light emitting unit on the substrate; and

forming a film encapsulation layer covering the organic light emitting unit,

wherein forming the film encapsulation layer comprises;

forming at least a hydrophobic organic layer covering the organic light emitting unit with a plasma enhanced chemical vapor deposition method, wherein the film encapsulation layer comprises the hydrophobic organic layer, and wherein the hydrophobic organic layer is disposed at an outermost portion of the film encapsulation layer,

wherein the hydrophobic organic layer comprises a fluorinated hybrid polymer organic film, and the fluorinated hybrid polymer organic film comprises, in atomic percent, 10 at % to 50 at % of fluorine atom F, 1 at % to 30 at % of silicon atom Si, 1 at % to 30 at % of oxygen atom O, and 15 at % to 50 at % of carbon atom C.

2. The method for manufacturing the organic light emitting display apparatus according to claim 1, where forming the film encapsulation layer comprises:

forming an inorganic blocking layer covering the organic light emitting unit with an atomic layer deposition method, a plasma enhanced chemical vapor deposition method, or a physical vapor deposition method; and

forming the hydrophobic organic layer covering the inorganic blocking layer with a plasma enhanced chemical vapor deposition method.

3. The method for manufacturing the organic light emitting display apparatus according to claim 2, further comprising:

alternately forming hydrophobic organic layers and inorganic blocking layers M times, wherein 0≦

M≦

10, and M is a positive integer.

4. The method for manufacturing the organic light emitting display apparatus according to claim 1, wherein a contact angle between the hydrophobic organic layer and water ranges from 90°

to 170°

.

5. The method for manufacturing the organic light emitting display apparatus according to claim 1, wherein a contact angle between the hydrophobic organic layer and water ranges from 110°

to 160°

.

6. The method for manufacturing the organic light emitting display apparatus according to claim 1, wherein the hydrophobic organic layer is made from a precursor comprising fluorinated silane and silane.

7. The method for manufacturing the organic light emitting display apparatus according to claim 6, wherein the hydrophobic organic layer is made from a precursor comprising heptadecafluorodecyl trimethoxysilane and tetramethoxysilane.

8. The method for manufacturing the organic light emitting display apparatus according to claim 2, wherein the inorganic blocking layer comprises one or more of a metal oxide, a metal nitride, a silicon oxide, and a silicon nitride.

9. The method for manufacturing the organic light emitting display apparatus according to claim 2, further comprising:

alternately forming hydrophobic organic layers and inorganic blocking layers M times, wherein 0≦

M≦

5, and M is a positive integer.

10. The method for manufacturing the organic light emitting display apparatus according to claim 1, wherein the formed hydrophobic organic layer has a thickness in a range of 500 nm to 3000 nm.

11. The method for manufacturing the organic light emitting display apparatus according to claim 2, wherein the formed inorganic blocking layer has a thickness in a range of 300 nm to 1000 nm.

12. The method for manufacturing the organic light emitting display apparatus according to claim 2, wherein formed the film encapsulation layer has a thickness in a range of 0.5 μ

m to 10 μ

m.

13. The method for manufacturing the organic light emitting display apparatus according to claim 2, wherein the formed hydrophobic organic layer has a thickness larger than that of the formed inorganic blocking layer.

14. The method for manufacturing the organic light emitting display apparatus according to claim 1, wherein the formed hydrophobic organic layer comprising hydrophobic organic material having C—

F bond, Si—

C bond, Si—

O—

Si bonds and C—

H bond.