MULTILAYER WIRING BOARD

• US 20160066415A1
• Filed: 08/25/2015
• Published: 03/03/2016
• Est. Priority Date: 08/28/2014
• Status: Abandoned Application

• Current Assignee: DENSO Corporation, Meisei Gakuen
• Original Assignee: DENSO Corporation, Meisei Gakuen
• Inventors: KONDOH, Kouji, OTSUKA, Kanji, AKIYAMA, Yutaka, KATAOKA, Ryohei, AKIMICHI, Jyun, HASHIMOTO, Kaoru
• Application Number:
  US14/834,483
• Publication Number:
  US 20160066415A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/0245 Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/0298 Multilayer circuits

Abstract

A multilayer wiring board includes an insulating layers stacked on one another, lands formed on an upper surface part of the multilayer wiring board, and a differential transmission line formed on or in each of the insulating layer. An electronic component is mounted on the lands. The differential transmission line is constituted of a pair of signal lines which extend from the lands toward a signal receiving end. Each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers, and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open.

Claims

1. A multilayer wiring board comprising:

insulating layers stacked on one another;

lands formed on an upper surface part of the multilayer wiring board, an electronic component being mounted on the lands; and

a differential transmission line formed on or in each of the insulating layers, the differential transmission line being constituted of a pair of signal lines which extend from the lands toward a signal receiving end, wherein

each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open.

2. The multilayer wiring board according to claim 1, wherein the open stubs are disposed within a distance smaller than 1% of an entire length of the differential transmission line from the lands that serve as a signal transmitting end.

3. The multilayer wiring board according to claim 2, wherein the open stubs are disposed immediately below the lands that serve as the signal transmitting end.

4. The multilayer wiring board according to claim 1, wherein a plurality of the open stubs are provided to each of the signal lines so as to be arranged in a direction in which the signal lines extend.

5. The multilayer wiring board according to claim 1, wherein the open stub of one of the signal lines and the open stub of another signal line are disposed at positions opposite to each other with respect to a direction in which the signal lines extend.

6. The multilayer wiring board according to claim 1, wherein the open stub of one of the signal lines and the open stub of another signal line are disposed at positions shifted from each other in a direction in which the signal lines extend.

7. A multilayer wiring board comprising:

insulating layers stacked on one another;

lands formed on an upper surface part of the multilayer wiring board, an electronic component being mounted on the lands; and

a differential transmission line formed on or in each of the insulating layer except the uppermost insulating layer, the differential transmission line being constituted of a pair of signal lines which extend from the lands toward a signal receiving end, wherein

each of the signal lines is provided with a stub which extends along a surface of the insulating layer and spreads in a width direction of the signal line.