MULTICHIP MODULES AND METHODS OF FABRICATION
First Claim
1. An assembly comprising:
- a wiring board comprising circuitry comprising a plurality of contact pads at a top side of the wiring board;
a plurality of first chips, each first chip comprising circuitry which comprises;
one or more first contact pads at a bottom side of the first chip; and
one or more second contact pads at the bottom side of the first chip that are directly connected to one or more of the contact pads of the wiring board;
a second chip overlying the wiring board and comprising circuitry comprising a plurality of first contact pads at a top side of the second chip, wherein at least one first contact pad of each first chip is attached to at least one first contact pad of the second chip;
wherein at least one direct connection of at least one second contact pad of at least one first chip to at least one of the contact pads of the wiring board lies between the first chip and the wiring board and is longer than a thickness of the second chip.
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0 Petitions
Accused Products
Abstract
In a multi-chip module (MCM), a “super” chip (110N) is attached to multiple “plain” chips (110F′ “super” and “plain” chips can be any chips). The super chip is positioned above the wiring board (WB) but below at least some of plain chips (110F). The plain chips overlap the super chip. Further, the plain chips'"'"' low speed IOs can be connected to the WB by long direct connections such as bond wires (e.g. BVAs) or solder stacks; such connections can be placed side by side with the super chip. Such connections can be long, so the super chip is not required to be thin. Also, if through-substrate vias (TSVs) are omitted, the manufacturing yield is high and the manufacturing cost is low. Other structures are provided that combine the short and long direct connections to obtain desired physical and electrical properties.
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Citations
20 Claims
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1. An assembly comprising:
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a wiring board comprising circuitry comprising a plurality of contact pads at a top side of the wiring board; a plurality of first chips, each first chip comprising circuitry which comprises; one or more first contact pads at a bottom side of the first chip; and one or more second contact pads at the bottom side of the first chip that are directly connected to one or more of the contact pads of the wiring board; a second chip overlying the wiring board and comprising circuitry comprising a plurality of first contact pads at a top side of the second chip, wherein at least one first contact pad of each first chip is attached to at least one first contact pad of the second chip; wherein at least one direct connection of at least one second contact pad of at least one first chip to at least one of the contact pads of the wiring board lies between the first chip and the wiring board and is longer than a thickness of the second chip. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An assembly comprising:
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a wiring board comprising circuitry comprising a plurality of contact pads at a top side of the wiring board; a plurality of first chips overlying the wiring board and having their bottom sides attached to the wiring board, wherein each first chip comprises circuitry which comprises one or more first contact pads at a top side of the first chip; and a second chip overlying the wiring board and comprising circuitry comprising a plurality of first contact pads at a bottom side of the second chip which are attached to the first contact pads of the first chips; wherein at least one of the first and second chips comprises one or more second contact pads directly connected to one or more of the contact pads of the wiring board. - View Dependent Claims (9, 10, 11)
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12. An assembly comprising:
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a wiring board comprising circuitry comprising a plurality of contact pads at a top side of the wiring board, the wiring board comprising a cavity at the top side; a plurality of first chips, each first chip comprising circuitry which comprises; one or more first contact pads at a bottom side of the first chip; and one or more second contact pads at the bottom side of the first chip that are directly connected to one or more of the contact pads of the wiring board; a second chip overlying the wiring board and partially located in the cavity, the second chip comprising circuitry comprising a plurality of first contact pads at a top side of the second chip that are attached to one or more of the first contact pads of the first chip; wherein at least one direct connection of at least one second contact pad of at least one first chip to at least one of the contact pads of the wiring board lies between the first chip and the wiring board and is longer than at least one attachment between at least one first contact pad of the first chip to at least one first contact pad of the second chip.
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13. An assembly comprising:
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a wiring board comprising circuitry comprising one or more contact pads at a top side of the wiring board and one or more contact pads at a bottom side of the wiring board; a first plurality of chips attached to a top side of the wiring board and comprising; one or more first chips, each first chip comprising circuitry comprising one or more first contact pads at a top side of the first chip; and one or more second chips, each second chip comprising circuitry comprising one or more second contact pads at a bottom side of the second chip which are attached to respective one or more of the first contact pads of one or more of the first chips; wherein the circuitry of at least one second chip comprises one or more contact pads at the bottom side of the second chip which are directly connected to one or more contact pads at the top side of the wiring board; wherein the assembly further comprises; a second plurality of chips attached to a bottom side of the wiring board and comprising; one or more first chips, each first chip of the second plurality comprising circuitry comprising one or more first contact pads at a bottom side of the first chip; and one or more second chips, each second chip of the second plurality comprising circuitry comprising one or more second contact pads at a top side of the second chip which are attached to respective one or more of the first contact pads of one or more of the first chips of the second plurality; wherein the circuitry of at least one second chip of the second plurality comprises one or more contact pads at the top side of the second chip which are directly connected to one or more contact pads at the bottom side of the wiring board.
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14. A manufacturing process comprising:
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obtaining a plurality of first modules each of which comprises circuitry with one or more contact pads, each first module being a single-chip or multi-chip module; placing a molding compound in physical contact with each first module, and curing the molding compound, to form a first structure in which the first modules are held together by at least the molding compound, wherein the circuitry of each of at least two of the first modules has one or more contact pads exposed in the first structure; obtaining one or more second modules each of which comprises circuitry with one or more contact pads, each second module being a single-chip or multi-chip module; assembling the first structure and the one or more second modules to form a sub-module in which the second and first modules are interconnected through the contact pads of the first and second modules; attaching the sub-module to a wiring board comprising circuitry and one or more contact pads, to obtain a third module in which at least one of the first and second modules and the circuitry of the wiring board are interconnected through the one or more of said contact pads of the wiring board.
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15. A manufacturing process comprising:
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(1) obtaining a plurality of assemblies, wherein obtaining assembly of said assemblies comprises performing a process comprising; obtaining a plurality of first modules for the assembly, each first module being a single-chip or multi-chip module comprising circuitry; placing first molding compound in physical contact with each first module, and curing the first molding compound, to form a first structure in which the first modules are held together by at least the first molding compound, wherein the circuitry of each of at least two of the first modules has one or more first contact pads and one or more second contact pads on a bottom side of the first structure; forming one or more layers on the bottom side of the first structure, the one or more layers providing bottom-side circuitry connected to one or more of the second contact pads on the bottom side of the first structure; forming one or more first through-holes through the first molding compound, each first through-hole passing between top and bottom sides of the first molding compound; and forming one or more first conductive vias in the one or more first through-holes, each first conductive via reaching and physically contacting the bottom-side circuitry, each first conductive via being accessible from the top side of the first molding compound; obtaining one or more second modules each of which comprises circuitry with one or more first contact pads, each second module being a single-chip or multi-chip module; and attaching each second module below the bottom side of the first structure to form a second structure in which each second module and the first modules are interconnected through the first contact pads of the first and second modules; forming second molding compound on a bottom side of the second structure; forming one or more second through-holes through the second molding compound, each second through-hole passing between top and bottom sides of the second molding compound; and forming one or more second conductive vias in the one or more second through-holes, each second conductive via reaching and physically contacting the bottom-side circuitry, each second conductive via being accessible from the bottom side of the second molding compound; (2) forming a stack of said assemblies, wherein for each two adjacent assemblies in the stack, at least one second conductive via of one of the two adjacent assemblies is attached to at least one first conductive via of the other one of the two adjacent assemblies.
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16. A manufacturing process comprising:
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obtaining a plurality of first modules each of which comprises circuitry with one or more first contact pads, each first module being a single-chip or multi-chip module; obtaining one or more second modules each of which comprises circuitry with one or more first contact pads, each second module being a single-chip or multi-chip module; attaching the one or more first contact pads of the one or more second modules to the one or more first contact pads of the first modules so that all the first modules are on top side of each second module, and placing first molding compound in physical contact with each first and second module, and curing the first molding compound, to form a first structure in which the first and second modules are held together by at least the first molding compound, wherein the circuitry of each of at least two of the first modules has one or more second contact pads on a bottom side of the first structure; thinning the first molding compound from the bottom side of each second module; after said thinning, forming one or more layers on the bottom side of the first structure, the one or more layers providing bottom-side circuitry connected to one or more of the second contact pads located on the bottom side of the first structure; forming one or more first through-holes through the first molding compound, each first through-hole passing between top and bottom sides of the first molding compound; and forming one or more first conductive vias in the one or more first through-holes, each first conductive via reaching and physically contacting the bottom-side circuitry, each first conductive via being accessible from the top side of the first molding compound. - View Dependent Claims (17)
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18. A microelectronic structure comprising:
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a first structure comprising; a plurality of first modules each of which comprises circuitry, each first module being a single-chip or multi-chip module; first molding compound in physical contact with each first module, wherein the first modules are held together by at least the first molding compound, wherein the circuitry of each of at least two of the first modules has first and second contact pads on a bottom side of the first structure; wherein the microelectronic structure further comprises; one or more layers on the bottom side of the first structure, the one or more layers providing bottom-side circuitry directly connected to each second contact pad on the bottom side of the first structure; one or more first through-holes through the first molding compound, each first through-hole passing between top and bottom sides of the first molding compound; one or more first conductive vias in the one or more first through-holes, each first conductive via reaching and physically contacting the bottom-side circuitry, each first conductive via being accessible from the top side of the first molding compound; one or more second modules each of which comprises circuitry with one or more first contact pads, each second module being a single-chip or multi-chip module, each second module being attached below the bottom side of the first structure to form an assembly in which each second module and the first modules are interconnected through the first contact pads of the first and second modules; second molding compound on a bottom side of the assembly; one or more second through-holes through the second molding compound, each second through-hole passing between top and bottom sides of the second molding compound; and one or more second conductive vias in the one or more second through-holes, each second conductive via reaching and physically contacting the bottom-side circuitry, each second conductive via being accessible from the bottom side of the first molding compound.
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19. A microelectronic structure comprising:
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a first structure comprising; a plurality of first modules each of which comprises circuitry, each first module being a single-chip or multi-chip module; first molding compound in physical contact with each first module, wherein the first modules are held together by at least the first molding compound, wherein the circuitry of each of at least two of the first modules has first and second contact pads on a bottom side of the first structure; wherein the microelectronic structure further comprises; one or more layers on the bottom side of the first structure, the one or more layers providing bottom-side circuitry directly connected to each second contact pad on the bottom side of the first structure, the bottom-side circuitry comprising one or more contact pads at a bottom side of the bottom-side circuitry; one or more first through-holes through the first molding compound, each first through-hole passing between top and bottom sides of the first molding compound; one or more first conductive vias in the one or more first through-holes, each first conductive via reaching and physically contacting the bottom-side circuitry, each first conductive via being accessible from the top side of the first molding compound; one or more second modules each of which comprises circuitry with one or more first contact pads, each second module being a single-chip or multi-chip module, each second module being attached below the bottom side of the first structure to form an assembly in which each second module and the first modules are interconnected through the first contact pads of the first and second modules; second molding compound on a bottom side of the assembly in physical contact with the first and second modules, the second molding compound not covering the one or more contact pads of the bottom side circuitry.
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20. A manufacturing process comprising:
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obtaining a plurality of first modules each of which comprises circuitry with one or more first contact pads, each first module being a single-chip or multi-chip module; obtaining a second module each of which comprises circuitry with one or more second contact pads, each second module being a single-chip or multi-chip module; holding the second module on a holding stage with the one or more second contact pads facing away from the holding stage; with the second module being held on the holding stage, attaching the first modules to the second module such that the one or more first contact pads of each first module become attached to one or more second contact pads, so that the first modules become fastened to each other through the second module in the attaching operation.
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Specification