INDUCTOR ARRAY CHIP AND BOARD HAVING THE SAME

• US 20160078997A1
• Filed: 04/03/2015
• Published: 03/17/2016
• Est. Priority Date: 09/16/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Yu Jin, KIM, Ho Yoon, Son, Soo Hwan
• Application Number:
  US14/678,912
• Publication Number:
  US 20160078997A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

There are provided an inductor array chip and a board having the same. The inductor array chip includes: a body in which a plurality of magnetic layers are stacked; first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias formed in the plurality of magnetic layers; and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.

Claims

1. An inductor array chip comprising:

a body in which a plurality of magnetic layers are stacked;

first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias disposed in the plurality of magnetic layers; and

first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts,

wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.

2. The inductor array chip of claim 1, wherein the first coil part and the second coil part are symmetrical with respect to each other on the basis of the gap layer disposed in the body.

3. The inductor array chip of claim 1, wherein the gap layer has a thickness of 5 μ

m or more while the thickness of the gap layer is equal to or less than half of a thickness of the first or second coil part.

4. The inductor array chip of claim 1, wherein the first coil part and the second coil part have respective central cores positioned in the same position in a stacking direction of the body.

5. The inductor array chip of claim 1, wherein the first coil part and the second coil part have the same direction of rotation.

6. The inductor array chip of claim 1, wherein the first coil part and the second coil part have opposing directions of rotation.

7. The inductor array chip of claim 1, wherein the gap layer includes a Zn-ferrite based non-magnetic material having low permeability or a dielectric material, including at least one of SiO₂, Al₂O₂, TiO₂, and ZrO₂.

8. The inductor array chip of claim 1, wherein the first coil part and the second coil part are non-coupled type coils.

9. The inductor array chip of claim 1, wherein the first and second external electrodes are input terminals, and the third and fourth external electrodes are output terminals.

10. A board having an inductor array chip, the board comprising:

a printed circuit board on which a plurality of electrode pads are provided; and

an inductor array chip mounted on the printed circuit board,

wherein the inductor array chip includes a body in which a plurality of magnetic layers are stacked, first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias provided in the plurality of magnetic layers, and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, and

the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.

11. The board of claim 10, wherein the first coil part and the second coil part are symmetrical with respect to each other on the basis of the gap layer disposed in the body.

12. The board of claim 10, wherein the gap layer has a thickness of 5 μ

m or more while the thickness of the gap layer is equal to or less than half of a thickness of the first or second coil part.

13. The board of claim 10, wherein the first coil part and the second coil part have respective central cores positioned in the same position in a stacking direction of the body.

14. The board of claim 10, wherein the first coil part and the second coil part have the same direction of rotation.

15. The board of claim 10, wherein the first coil part and the second coil part have opposite directions of rotation.

16. The board of claim 10, wherein the gap layer includes a Zn-ferrite based non-magnetic material having low permeability or a dielectric material including at least one of SiO₂, Al₂O₃, TiO₂, and ZrO₂.

17. The board of claim 10, wherein the first coil part and the second coil part are non-coupled type coils.

18. The board of claim 10, wherein the first and second external electrodes are input terminals, and the third and fourth external electrodes are output terminals.