METHOD FOR FABRICATING AN IMAGE SENSOR PACKAGE
First Claim
1. A method for fabricating an image sensor package, comprising:
- providing a first substrate comprising a via therein, wherein the first substrate comprises an upper surface and a lower surface opposite the upper surface;
forming a driving circuit on the upper surface of the first substrate and electrically connected to the via;
bonding a second substrate to the first substrate, wherein the second substrate comprises a first surface and a second surface opposite the first surface, and wherein a photosensitive device is on the first surface and is electrically connected to the driving circuit;
forming a support member on the second surface of the second substrate; and
disposing a covering plate on the second surface of the second substrate.
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Abstract
An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.
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Citations
20 Claims
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1. A method for fabricating an image sensor package, comprising:
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providing a first substrate comprising a via therein, wherein the first substrate comprises an upper surface and a lower surface opposite the upper surface; forming a driving circuit on the upper surface of the first substrate and electrically connected to the via; bonding a second substrate to the first substrate, wherein the second substrate comprises a first surface and a second surface opposite the first surface, and wherein a photosensitive device is on the first surface and is electrically connected to the driving circuit; forming a support member on the second surface of the second substrate; and disposing a covering plate on the second surface of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification