LIGHT-EMITTING DIODE PACKAGE STRUCTURE

• US 20160079496A1
• Filed: 11/17/2015
• Published: 03/17/2016
• Est. Priority Date: 10/14/2013
• Status: Abandoned Application

• Current Assignee: Genesis Photonics Inc.
• Original Assignee: Genesis Photonics Inc.
• Inventors: Wu, Chih-Ling, HUANG, YI-RU, Lo, Yu-Yun, Huang, Jing-En, Ting, Shao-Ying, Liao, Kuan-Yung
• Application Number:
  US14/943,036
• Publication Number:
  US 20160079496A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light-emitting diode package structure includes a package carrier, a light guiding component and a light emitting unit. The light guiding component is disposed on the package carrier. The light emitting unit is disposed on an upper surface of light guiding component relatively distant from the package carrier. A horizontal projection area of the light guiding component is greater than that of the light emitting unit. The light emitting unit is adapted to emit a light beam, and a portion of the light beam enters the light guiding component and emits from the upper surface of the light guiding component. An included angle existing between the light beam and a normal direction of the upper surface ranges from 0 degree to 75 degrees.

Claims

1. A light-emitting diode package structure, comprising:

a package carrier;

a plate-like light guiding component, disposed on the package carrier;

a light emitting unit, being capable of emitting a light, disposed on a first portion of an upper surface of the light guiding component and at least exposing a second portion of the upper surface of the light guiding component; and

a sealant, sealing the light guiding component and the light emitting unit, wherein the sealant extracts a first portion of the light directly from the light emitting unit and a second portion of the light from the second portion of the upper surface of the light guiding component.

2. The light-emitting diode package structure as claimed in claim 1, wherein the light guiding component comprises a transparent unit and an underlying reflecting layer, wherein the second portion of the light passing through the transparent unit is reflected by the underlying reflecting layer.

3. The light-emitting diode package structure as claimed in claim 1, wherein the second portion of the light passing through the light guiding component is reflected by the package carrier.

4. The light-emitting diode package structure as claimed in claim 1, wherein the light guiding component has no obliquely running side areas.

5. The light-emitting diode package structure as claimed in claim 1, further comprising a fluorescent material distributed in the sealant.

6. The light-emitting diode package structure as claimed in claim 1, wherein the light emitting unit comprises a light emitting layer disposed on a substrate, wherein the substrate directly contacts the light guiding component.

7. The light-emitting diode package structure as claimed in claim 1, wherein the light emitting unit comprises a light emitting layer disposed on a substrate, wherein the light emitting layer is located between the light guiding component and the substrate.

8. The light-emitting diode package structure as claimed in claim 6, wherein the refractive index of the light guiding component is smaller than or equal to the refractive index of the substrate of the light emitting unit.

9. The light-emitting diode package structure as claimed in claim 1, wherein the second portion of the upper surface of the light guiding component comprises a rough surface.

10. The light-emitting diode package structure as claimed in claim 1, wherein the second portion of the upper surface of the light guiding component comprises a rough surface with periodic patterns.

11. A light-emitting diode package structure, comprising:

a package carrier;

a plate-like light guiding component having no obliquely running side areas, disposed on the package carrier;

a light emitting unit, being capable of emitting a light, disposed on a first portion of an upper surface of the light guiding component and at least exposing a second portion of the upper surface of the light guiding component;

a wavelength-conversion layer, covering the light guide component and the light emitting unit, wherein the wavelength-conversion layer extracts a first portion of the light directly from the light emitting unit and a second portion of the light from the second portion of the upper surface of the light guiding component; and

a package encapsulant, encapsulating the package carrier and the wavelength-conversion layer.

12. The light-emitting diode package structure as claimed in claim 11, wherein the package carrier has a recess, and the light guiding component, the light emitting unit and the wavelength-conversion layer are disposed therein.

13. The light-emitting diode package structure as claimed in claim 11, wherein the light guiding component comprises a transparent unit and an underlying reflecting layer, wherein the second portion of the light passing through the transparent unit is reflected by the underlying reflecting layer.

14. The light-emitting diode package structure as claimed in claim 11, wherein the second portion of the light passing through the light guiding component is reflected by the package carrier.

15. The light-emitting diode package structure as claimed in claim 11, wherein the light emitting unit comprises a light emitting layer disposed on a substrate, wherein the substrate directly contacts the light guiding component.

16. The light-emitting diode package structure as claimed in claim 11, wherein the light emitting unit comprises a light emitting layer disposed on a substrate, wherein the light emitting layer is located between the light guiding component and the substrate.

17. The light-emitting diode package structure as claimed in claim 15, wherein the refractive index of the light guiding component is smaller than or equal to the refractive index of the substrate of the light emitting unit.

18. The light-emitting diode package structure as claimed in claim 11, wherein the second portion of the upper surface of the light guiding component comprises a rough surface.

19. A light-emitting diode package structure, comprising:

a package carrier;

a plate-like light guiding unit having no obliquely running side areas, disposed on the package carrier;

a reflecting layer, disposed between the light guiding unit and the package carrier; and

a light emitting unit, being capable of emitting a light, disposed on a first portion of an upper surface of the light guiding unit and at least exposing a second portion of the upper surface of the light guiding unit; and

a wavelength-conversion layer, covering the light guide unit, the reflecting layer and the light emitting unit, wherein the wavelength-conversion layer extracts a first portion of the light directly from the light emitting unit and a second portion of the light from the second portion of the upper surface of the light guiding unit.

20. The light-emitting diode package structure as claimed in claim 19, further comprising a package encapsulant encapsulating the package carrier and the wavelength-conversion layer.