Chip Antenna Module

• US 20160079673A1
• Filed: 09/15/2014
• Published: 03/17/2016
• Est. Priority Date: 09/15/2014
• Status: Abandoned Application

• Current Assignee: Sage Elephant Tech Co., Ltd.
• Original Assignee: Sage Elephant Tech Co., Ltd.
• Inventors: Chiu, Hung-Hsien
• Application Number:
  US14/487,048
• Publication Number:
  US 20160079673A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

A chip antenna module is provided for use with an electronic device. The antenna module includes an insulation section arranged on a metal layer and the insulation section forms a non-metal closed area. A radiation resonance section is arranged in the insulation section. The radiation resonance section includes negative and positive radiation resonators. A negative electrode path is slightly less than a quarter wavelength of a predetermined low frequency in order to resonate with the low frequency. The negative radiation resonator distal end section is arranged to resonate with a predetermined high frequency. The positive radiation resonator is arranged to resonate with a predetermined high frequency. By coupling the positive radiation resonator with the negative radiation resonator, antenna impedance can be adjusted. The present invention has a simple structure, greatly reduces the antenna size, and allows for receiving and transmission of wireless signals of multiple frequencies.

Claims

1. A chip antenna module, which comprises an insulation section arranged on a metal layer, the insulation section forming a non-metal closed area, a radiation resonance section being arranged in the insulation section, the radiation resonance section comprising a negative radiation resonator and a positive radiation resonator, the negative radiation resonator comprising a negative radiation resonator grounding section, which is electrically connected to the metal layer, the positive radiation resonator being electrically connected to the signal feeding source, a first path being defined as extending from a negative radiation resonator distal end section to the negative radiation resonator grounding section and a second path being defined as extending from the negative radiation resonator grounding section along an insulation section periphery to a signal feeding source grounding section, a sum of lengths of the first and second paths being slightly less than a quarter wavelength of a predetermined low frequency in order to resonate with the predetermined low frequency, the negative radiation resonator distal end section being arranged to resonate with a predetermined high frequency, the positive radiation resonator being arranged to resonate with a predetermined high frequency, whereby by coupling the positive radiation resonator with the negative radiation resonator, an antenna impedance is adjustable.

2. The chip antenna module as claimed in claim 1, wherein the insulation section comprises an insulation material selected from a rigid printed circuit board (PCB), a flexible printed circuit board (FPCB), a high dielectric material, and a plastic material, or a composite material of a combination thereof, the metal layer, the negative radiation resonator, and the positive radiation resonator being arranged on a carrier comprising the insulation material.

3. The chip antenna module as claimed in claim 1, wherein the signal feeding source comprises one of a coaxial cable, a radio frequency (RF) connector, and a microstrip transmission line.

4. The chip antenna module as claimed in claim 1, wherein the positive radiation resonator comprises one of an electrical capacitive element, an electrical inductive element, a plate-like conductor element, and a conductor wire.

5. The chip antenna module as claimed in claim 1, wherein the positive radiation resonator is mounted by means of surface mounting technology and a solder pad is pre-formed on the insulation section under the positive radiation resonator.

6. The chip antenna module as claimed in claim 1, wherein the metal layer comprises a metal element of an electronic device or is an independent metal layer.

7. The chip antenna module as claimed in claim 1, wherein the insulation section and the radiation resonance section are pre-assembled as an assembled body, which is arranged on the metal layer, the negative radiation resonator being electrically connected to the metal layer, the positive radiation resonator being electrically connected to the signal feeding source.