LIGHT EMITTING APPARATUS AND LIGHTING APPARATUS

• US 20160081142A1
• Filed: 08/18/2015
• Published: 03/17/2016
• Est. Priority Date: 09/11/2014
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: Abe, Masumi, Ogata, Toshifumi, Ishimori, Atsuyoshi, Sugiura, Kenji, Kurachi, Toshiaki
• Granted Patent: US 9,420,642 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

Light emitting apparatus including: substrate; LED chips on substrate; first sealing layer sealing LED chips; second sealing layer above first sealing layer; and phosphor layer containing yellow phosphor, disposed between first sealing layer and second sealing layer, wherein phosphor layer contains the yellow phosphor in higher density than first sealing layer and second sealing layer.

Claims

1. A light emitting apparatus comprising:

a substrate;

a light emitting element on the substrate;

a first sealing layer sealing the light emitting element;

a second sealing layer above the first sealing layer; and

a phosphor layer between the first sealing layer and the second sealing layer, the phosphor layer containing phosphor, wherein

the phosphor layer contains the phosphor in higher density than the first sealing layer and the second sealing layer.

2. The light emitting apparatus according to claim 1, wherein

the first sealing layer contains the phosphor.

3. The light emitting apparatus according to claim 1, wherein

the first sealing layer contains a filler, and

the second sealing layer is free of the filler.

4. The light emitting apparatus according to claim 1, wherein

the first sealing layer and the second sealing layer comprise a same resin material.

5. The light emitting apparatus according to claim 1, further comprising

a wire connected to the light emitting element to supply power to the light emitting element, wherein

the first sealing layer further seals the wire.

6. The light emitting apparatus according to claim 1, further comprising

a dam material enclosing around the light emitting element, wherein

the first sealing layer, the second sealing layer, and the phosphor layer are formed in a region enclosed around by the dam material.

7. A lighting apparatus comprising the light emitting apparatus according to claim 1.

8. A method for fabricating a light emitting apparatus, comprising:

(a) mounting a light emitting element on a substrate;

(b) forming a first sealing layer sealing the light emitting element; and

(c) forming a phosphor layer containing phosphor above the first sealing layer, and forming a second sealing layer above the phosphor layer, wherein

the phosphor layer contains the phosphor in higher density than the first sealing layer and the second sealing layer.

9. The method according to claim 8, wherein

in step (c), the phosphor layer and the second sealing layer are formed by applying a translucent resin containing the phosphor onto the first sealing layer and allowing the phosphor to settle in the applied translucent resin.