INORGANIC FILLER AND EPOXY RESIN COMPOSITION INCLUDING THE SAME
First Claim
Patent Images
1. An inorganic filler comprising:
- surface-modified boron nitride; and
a polycyclic aromatic hydrocarbon having a functional group formed on a surface of the boron nitride.
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Abstract
An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.
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Citations
20 Claims
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1. An inorganic filler comprising:
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surface-modified boron nitride; and a polycyclic aromatic hydrocarbon having a functional group formed on a surface of the boron nitride. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An epoxy resin composition comprising:
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an epoxy compound; and an inorganic filler including surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A printed circuit board comprising:
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a substrate; an insulating layer formed on the substrate; and a circuit pattern formed on the insulating layer, wherein the insulating layer includes an epoxy resin composition, which includes an epoxy compound, and an inorganic filler including surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided. - View Dependent Claims (18, 19, 20)
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Specification