INORGANIC FILLER AND EPOXY RESIN COMPOSITION INCLUDING THE SAME

• US 20160081188A1
• Filed: 08/17/2015
• Published: 03/17/2016
• Est. Priority Date: 09/12/2014
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: GU, Jina, NA, Se Woong, YUN, Sung Jin, JU, Sanga
• Granted Patent: US 10,231,332 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C07F 5/05 Cyclic compounds having at least one ring containing boron but no carbon in the ring
• CPC Class Codes: C08K 2003/382 and nitrogen
• CPC Class Codes: C08K 9/04 Ingredients treated with organic substances treated with macromolecular compounds C08K9/08
• CPC Class Codes: C08K 9/08 Ingredients agglomerated by treatment with a binding agent
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09C 1/00 Treatment of specific inorganic materials other than fibrous fillers tenebrescent materials C09K9/00; luminescent materials C09K11/00; Preparation of carbon black
• CPC Class Codes: C09C 3/08 Treatment with low-molecular-weight non-polymer organic compounds C09C3/006, C09C3/048 take precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 3/4676 Single layer compositions

Abstract

An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.

Claims

1. An inorganic filler comprising:

surface-modified boron nitride; and

a polycyclic aromatic hydrocarbon having a functional group formed on a surface of the boron nitride.

2. The inorganic filler of claim 1, wherein the polycyclic aromatic hydrocarbon includes at least one selected from the group consisting of naphthalene, anthracene and pyrene.

3. The inorganic filler of claim 1, wherein the functional group is selected from the group consisting of —

OH, —

NH₂, —

COOH, —

HSO₃, —

NH₂CO, Cl, Br, F, C₁ to C₃ alkyls, C₂ to C₃ alkenes, and C₂ to C₃ alkynes.

4. The inorganic filler of claim 1, wherein the inorganic filler includes the boron nitride at 85 to 99 vol % and the polycyclic aromatic hydrocarbon at 1 to 15 vol %.

5. The inorganic filler of claim 4, wherein the inorganic filler includes the boron nitride at 88 to 97 vol % and the polycyclic aromatic hydrocarbon at 3 to 12 vol %.

6. The inorganic filler of claim 1, wherein the boron nitride includes hexagonal boron nitride formed in a hexagonal lattice by alternately arranging nitrogen atoms and boron atoms.

7. The inorganic filler of claim 6, wherein the boron nitride is stacked in layers, wherein each layer includes a plurality of hexagonal boron nitride arranged on a plane.

8. The inorganic filler of claim 7, wherein the polycyclic aromatic hydrocarbon having a functional group is bonded to at least one of the uppermost layer and the lowermost layer of the plurality of layers.

9. The inorganic filler of claim 7, wherein the polycyclic aromatic hydrocarbon having a functional group is bonded between the plurality of layers.

10. An epoxy resin composition comprising:

an epoxy compound; and

an inorganic filler including surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.

11. The epoxy resin composition of claim 10, wherein the polycyclic aromatic hydrocarbon includes at least one selected from the group consisting of naphthalene, anthracene and pyrene.

12. The epoxy resin composition of claim 10, wherein the functional group is selected from the group consisting of —

OH, —

NH₂, —

COOH, —

HSO₃, —

NH₂CO, Cl, Br, F, C₁ to C₃ alkyls, C₂ to C₃ alkenes, and C₂ to C₃ alkynes.

13. The epoxy resin composition of claim 10, wherein the boron nitride is included at 85 to 99 vol % and the polycyclic aromatic hydrocarbon is included at 1 to 15 vol % with respect to 100 vol % of the inorganic filler.

14. The epoxy resin composition of claim 10, wherein the volumetric ratio of the epoxy compound to the inorganic filler is 10:

30 to 120.

15. The epoxy resin composition of claim 14, wherein the volumetric ratio of the epoxy compound to the inorganic filler is 10:

36 to 90.

16. The epoxy resin composition of claim 15, wherein the volumetric ratio of the epoxy compound to the inorganic filler is 10:

44 to 60.

17. A printed circuit board comprising:

a substrate;

an insulating layer formed on the substrate; and

a circuit pattern formed on the insulating layer,

wherein the insulating layer includes an epoxy resin composition, which includes an epoxy compound, and an inorganic filler including surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.

18. The printed circuit board of claim 17, wherein the polycyclic aromatic hydrocarbon includes at least one selected from the group consisting of naphthalene, anthracene and pyrene.

19. The printed circuit board of claim 17, wherein the functional group is selected from the group consisting of —

OH, —

NH₂, —

COOH, —

HSO₃, —

NH₂CO, Cl, Br, F, C₁ to C₃ alkyls, C₂ to C₃ alkenes, and C₂ to C₃ alkynes.

20. The printed circuit board of claim 17, wherein the boron nitride includes hexagonal boron nitride formed in a hexagonal lattice by alternately arranging nitrogen atoms and boron atoms.