ARRANGEMENT AND METHOD FOR COOLING LIQUID-COOLED ELECTRONICS
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Accused Products
Abstract
An arrangement and a method are provided for cooling liquid-cooled electronics. The arrangement includes a pipe system, said pipe system including receiving and exit coolant flow pipes for connecting the arrangement to a liquid-cooling system of said liquid-cooled electronics, inlet and outlet coolant flow pipes for connecting the arrangement to a heat exchanger arrangement, and an expansion tank connected to the coolant flow pipes. The arrangement further includes a coolant level transmitter arranged to detect the amount of the coolant in the expansion tank, a temperature measure arrangement arranged for measuring temperature of the coolant in the arrangement, and a leakage control system. The leakage control system includes a calculator for calculating a temperature corrected reference value for the amount of the coolant in the expansion tank and for calculating a temperature corrected coolant volume by using said temperature corrected reference value.
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Citations
29 Claims
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1-14. -14. (canceled)
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15. An arrangement for cooling liquid-cooled electronics, the arrangement comprising:
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a pipe system, said pipe system comprising; receiving and exit coolant flow pipes for connecting the arrangement to a liquid-cooling system of said liquid-cooled electronics; inlet and outlet coolant flow pipes for connecting the arrangement to a heat exchanger arrangement; and an expansion tank connected to the coolant flow pipes; a coolant level transmitter arranged to detect the amount of the coolant in the expansion tank; a temperature measure arrangement arranged for measuring temperature of the coolant in the arrangement; and a leakage control system, the leakage control system comprising a calculator for calculating a temperature corrected reference value for the amount of the coolant in the expansion tank and for calculating a temperature corrected coolant volume by using said temperature corrected reference value. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for cooling liquid-cooled electronics, the method comprising the steps of:
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receiving coolant flow from the liquid-cooling system of said liquid-cooled electronics in a pipe system; feeding coolant flow to a heat exchanger arrangement; receiving cooled coolant flow from the heat exchanger arrangement to the pipe system; and feeding cooled coolant flow back from the pipe system to the liquid-cooling system of said liquid-cooled electronics, wherein said pipe system further comprises an expansion tank containing said coolant, whereby the method further comprises the steps of; detecting the amount of the coolant in the expansion tank; measuring a temperature of the coolant in the arrangement; and compensating a result by calculating coolant thermal expansion in the arrangement based on said temperature measurement. - View Dependent Claims (28, 29)
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Specification