METHOD TO PATTERN <10 MICROMETER CONDUCTING AND PASSIVATING FEATURES ON 3D SUBSTRATES FOR IMPLANTABLE DEVICES

• US 20160082271A1
• Filed: 03/14/2014
• Published: 03/24/2016
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Inventors: Tolosa, Vanessa, Pannu, Satinderpall S., Sheth, Heeral, Tooker, Angela C., Shah, Kedar G., Felix, Sarah H.
• Granted Patent: US 9,694,190 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/3756 Casings with electrodes thereon, e.g. leadless stimulators
• CPC Class Codes: H05K 3/02 in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.

Claims

1. A method of fabricating an implantable device, comprising the steps of:

providing a base,

providing a rotation system for rotating said base,

providing a deposition system for depositing material on said base,

using said rotation system and said deposition system to deposit at least one electrode on said base,

using said rotation system and said deposition system to deposit at least one electrically conducting lead on said base coupled to said at least one electrode, and

using said rotation system and said deposition system to deposit a protective coating on said base covering said at least one electrically conducting lead.

2. The method of fabricating an implantable device of claim 1 wherein said step of providing a base comprises providing a cylindrical base.

3. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit at least one electrically conducting lead on said base coupled to said at least one electrode comprises using said rotation system and said deposition system to deposit at least one electrically conducting lead having a feature size of <

10 micrometers.

4. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit at least one at least one electrode on said base comprises using said rotation system and said deposition system to deposit at least one at least one electrode having a feature size of <

10 micrometers.

5. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit at least one electrically conducting lead on said base coupled to said at least one electrode comprises using said rotation system and said deposition system to deposit at least one electrically conducting metal lead.

6. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit at least one electrically conducting lead on said base coupled to said at least one electrode comprises using said rotation system and said deposition system to deposit at least one electrically conducting polymer lead.

7. The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit at least one electrode on said base comprises using said rotation system and said deposition system to deposit at least one electrically conducting metal electrode on said base.

8. The method of fabricating an implantable device of claim 1 wherein said step of The method of fabricating an implantable device of claim 1 wherein said step of using said rotation system and said deposition system to deposit at least one electrode on said base comprises using said rotation system and said deposition system to deposit at least one electrically conducting polymer electrode on said base.

9. A method of fabricating an implantable device, comprising the steps of:

providing a base,

providing a rotation system for rotating said base,

providing a coating system for coating said base,

providing an ablating system for abating at least a portion of said coating,

using said rotation system, said coating system, and said ablating system to form at least one electrode on said base,

using said rotation system, said coating system, and said ablating system to form at least one electrically conducting lead on said base coupled to said at least one electrode, and

using said rotation system and said coating system deposit a protective coating on said base covering said at least one electrically conducting lead.

10. The method of fabricating an implantable device of claim 9 wherein said step of providing a base comprises providing a cylindrical base.

11. The method of fabricating an implantable device of claim 9 wherein said step of using said rotation system, said coating system, and said ablating system to form at least one electrically conducting lead on said base coupled to said at least one electrode comprises using said rotation system, said coating system, and said ablating system to form at least one electrically conducting lead on said base having a feature size of <

10 micrometers.

12. The method of fabricating an implantable device of claim 9 wherein said step of using said rotation system, said coating system, and said ablating system to form at least one electrode on said base comprises using said rotation system, said coating system, and said ablating system to form at least one electrode on said base having a feature size of <

10 micrometers.

13. The method of fabricating an implantable device of claim 9 wherein said step of using said rotation system, said coating system, and said ablating system to form at least one electrically conducting lead on said base coupled to said at least one electrode comprises using said rotation system, said coating system, and said ablating system to form at least one electrically conducting metal lead on said base.

14. The method of fabricating an implantable device of claim 9 wherein said step of using said rotation system, said coating system, and said ablating system to form at least one electrically conducting lead on said base coupled to said at least one electrode comprises using said rotation system, said coating system, and said ablating system to form at least one electrically conducting polymer lead on said base.

15. The method of fabricating an implantable device of claim 9 wherein said step of using said rotation system and said deposition system to deposit at least one electrode on said base comprises using said rotation system and said deposition system to deposit at least one electrical conducting metal electrode on said base.

16. The method of fabricating an implantable device of claim 9 wherein said step of using said rotation system and said deposition system to deposit at least one electrode on said base comprises using said rotation system and said deposition system to deposit at least one electrical conducting polymer electrode on said base.

17. An implantable device, comprising:

a cylindrical base,

at least one electrode on said cylindrical base,

at least one electrically conducting lead on said cylindrical base connected to said electrode wherein said electrically conducting lead has a feature size of <

10 micrometers, and a protective coating on said cylindrical base covering said at least one electrically conducting lead.

18. The implantable device of claim 17 wherein said at least one electrode on said cylindrical base has a feature size of <

10 micrometers.

19. The implantable device of claim 17 wherein said at least one electrode on said cylindrical base is an electrically conducting metal electrode.

20. The implantable device of claim 17 wherein said at least one electrode on said cylindrical base is an electrically conducting polymer electrode.