PHOTO-CURABLE RESIN COMPOSITION FOR OPTICAL COMPONENT, OPTICAL COMPONENT PRODUCED BY EMPLOYING THE RESIN COMPOSITION, AND OPTICAL COMPONENT PRODUCTION METHOD

• US 20160083505A1
• Filed: 03/31/2014
• Published: 03/24/2016
• Est. Priority Date: 05/17/2013
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Tanaka, Yukiko
• Application Number:
  US14/889,188
• Publication Number:
  US 20160083505A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C08G 59/20 characterised by the epoxy compounds used
• CPC Class Codes: C08G 59/24 carbocyclic
• CPC Class Codes: C08G 59/245 aromatic
• CPC Class Codes: C08G 59/68 characterised by the catalysts used
• CPC Class Codes: C08G 59/687 containing sulfur
• CPC Class Codes: C08L 2201/10 Transparent films; Clear coatings; Transparent materials
• CPC Class Codes: C08L 2205/025 containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
• CPC Class Codes: C08L 2205/05 containing polymer components which can react with one another
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 71/02 Polyalkylene oxides

Abstract

A photo-curable resin composition for an optical component is provided, the photo-curable resin composition including: (A) an epoxy resin having a refractive index of not less than 1.57; (B) an alicyclic epoxy resin; (C) an oxetane resin having at least one oxetane ring in its molecule; and (D) a photoacid generator; wherein the resin (A) is present in a proportion of 20 to 75 wt % based on the amount of an overall resin component of the resin composition; wherein the component (D) is present in a proportion of 0.5 to 2.5 parts by weight based on 100 parts by weight of the overall resin component; the resin composition being free from a solvent component and having a viscosity of 0.5 to 25 Pa·s in a 25° C. environment.

Claims

1. A photo-curable resin composition for an optical component, the photo-curable resin composition comprising:

(A) an epoxy resin having a refractive index of not less than 1.57;

(B) an alicyclic epoxy resin;

(C) an oxetane resin having at least one oxetane ring in its molecule; and

(D) a photoacid generator;

wherein the resin (A) is present in a proportion of 20 to 75 wt % based on an amount of an overall resin component of the resin composition;

wherein the component (D) is present in a proportion of 0.5 to 2.5 parts by weight based on 100 parts by weight of the overall resin component; and

wherein the resin composition is free from a solvent component and has a viscosity of 0.5 to 25 Pa·

s in a 25°

C. environment.

2. The photo-curable resin composition according to claim 1, wherein the epoxy resin (A) is a compound represented by the following general formula:

3. The photo-curable resin composition according to claim 1, wherein the photoacid generator (D) is an onium salt containing hexafluorophosphate or hexafluoroantimonate as an anion moiety.

4. The photo-curable resin composition according to claim 1, wherein the alicyclic epoxy resin (B) is present in a proportion of 10 to 50 wt % based on the amount of the overall resin component of the resin composition.

5. The photo-curable resin composition according to claim 1, wherein the oxetane resin (C) is present in a proportion of 5 to 50 wt % based on the amount of the overall resin component of the resin composition.

6. The photo-curable resin composition according to claim 1, wherein the resin composition has an Abbe number of 29 to 45 in a cured state.

7. An optical component comprising a cured resin obtainable by curing the photo-curable resin composition according to claim 1.

8. An optical component production method comprising the steps of:

filling a shaping mold with the photo-curable resin composition according to claim 1;

irradiating the resin composition with light in the shaping mold to cure the resin composition; and

heat-treating a resulting cured product.