CURRENT SENSOR DEVICE HAVING A SENSE RESISTOR IN A RE-DISTRIBUTION LAYER
First Claim
1. An electronic device for sensing a current, comprising:
- a semiconductor chip comprising a main face;
an electronic circuit integrated in the semiconductor chip;
a redistribution metallization layer disposed above the main face of the semiconductor chip;
a current path formed in the redistribution metallization layer, the current path forming a resistor that is connected at two resistance defining end points to the electronic circuit for sensing a current flowing through the current path; and
external contact elements connected with the redistribution metallization layer for feeding a current to be sensed into the current path.
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Accused Products
Abstract
The electronic device for sensing a current comprises a semiconductor chip comprising a main face, an electronic circuit integrated in the semiconductor chip, a redistribution metallization layer disposed above the main face of the semiconductor chip, a current path formed in the redistribution metallization layer, the current path forming a resistor that is connected at two resistance defining end points to the electronic circuit for sensing a current flowing through the current path, and external contact elements connected with the redistribution metallization layer for feeding a current to be sensed into the current path.
13 Citations
18 Claims
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1. An electronic device for sensing a current, comprising:
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a semiconductor chip comprising a main face; an electronic circuit integrated in the semiconductor chip; a redistribution metallization layer disposed above the main face of the semiconductor chip; a current path formed in the redistribution metallization layer, the current path forming a resistor that is connected at two resistance defining end points to the electronic circuit for sensing a current flowing through the current path; and external contact elements connected with the redistribution metallization layer for feeding a current to be sensed into the current path. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A current sensor device, comprising:
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a semiconductor chip comprising a main face and at least two contact pads disposed on the main face; a redistribution metallization layer disposed above the main face of the chip and connected to the contact pads; at least two external contact elements disposed above the redistribution metallization layer; a current path connecting the at least two external contact elements and being integral to said redistribution metallization layer, the current path comprising two end points, each one of the end points being connected with at least one of the contact pads.
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18. A current sensor device, comprising:
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a substrate; at least two contact pads disposed on a main face of the substrate; a redistribution layer disposed above the main face of the substrate and connected to the contact pads; at least two external contact elements disposed above the redistribution layer; a shunt line connecting the at least two external contact elements and being formed in the redistribution layer; and two sense lines, each one of the two sense lines connecting one of the contact pads with one of two end points of the shunt line.
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Specification