CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

• US 20160086716A1
• Filed: 05/06/2015
• Published: 03/24/2016
• Est. Priority Date: 09/18/2014
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: CHOI, Jae Yeol, CHOI, Youn Kyu, KIM, Hye Ah, YANG, Yun Young, KANG, Mi Jung
• Granted Patent: US 9,704,640 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.

Claims

1. A chip electronic component comprising:

a magnetic body containing a magnetic metal powder;

an internal coil part embedded in the magnetic body; and

a plating spreading prevention part coated on a surface of the magnetic body,

wherein the plating spreading prevention part contains phosphate-based glass.

2. The chip electronic component of claim 1, wherein the phosphate-based glass contains one or more selected from the group consisting of iron phosphate, zinc phosphate, and manganese phosphate.

3. The chip electronic component of claim 1, wherein the plating spreading prevention part is coated on the magnetic metal powder exposed to the surface of the magnetic body.

4. The chip electronic component of claim 1, further comprising a silicon coating layer disposed on the magnetic body on which the plating spreading prevention part is formed.

5. The chip electronic component of claim 1, wherein the magnetic body contains a first magnetic metal powder and a second magnetic metal powder having a D₅₀ smaller than a D₅₀ of the first magnetic metal powder,

the first magnetic metal power having a D₅₀ of 18 μ

m to 22 μ

m, and the second magnetic metal power having a D₅₀ of 2 μ

m to 4 μ

m.

6. The chip electronic component of claim 1, wherein the magnetic body contains the first magnetic metal powder and the second magnetic metal powder having an average particle size smaller than an average particle size of the first magnetic metal powder,

the first magnetic metal power having a particle size of 11 μ

m to 53 μ

m, and the second magnetic metal power having a particle size of 0.5 μ

m to 6 μ

m.

7. The chip electronic component of claim 1, further comprising external electrodes disposed on an outer portion of the magnetic body to be connected to end portions of the internal coil part,

wherein the external electrodes include conductive resin layers and plating layers formed on the conductive resin layers.

8. The chip electronic component of claim 7, wherein the plating layers contain one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

9. A chip electronic component comprising:

a magnetic body containing a magnetic metal powder;

an internal coil part embedded in the magnetic body; and

a plating spreading prevention part coated on a magnetic metal powder exposed to a surface of the magnetic body,

wherein the plating spreading prevention part contains glass.

10. A manufacturing method of a chip electronic component, the manufacturing method comprising:

forming a magnetic body in which an internal coil part is embedded and a magnetic metal powder is contained; and

dipping the magnetic body in a phosphate solution to form a plating spreading prevention part on the magnetic metal powder exposed to a surface of the magnetic body.

11. The manufacturing method of claim 10, wherein the phosphate solution has a molar concentration of 0.1M or more.

12. The manufacturing method of claim 10, wherein a temperature of the phosphate solution is 50°

C. or more.

13. The manufacturing method of claim 10, further comprising, after the dipping of the magnetic body in the phosphate solution, heat-treating the magnetic body at a temperature of 180°

C. or more.

14. The manufacturing method of claim 10, wherein the plating spreading prevention part contains phosphate-based glass.

15. The manufacturing method of claim 14, wherein the phosphate-based glass contains one or more selected from the group consisting of iron phosphate, zinc phosphate, and manganese phosphate.

16. The manufacturing method of claim 10, further comprising, after the forming of the plating spreading prevention part, forming a silicone coating layer on the magnetic body on which the plating spreading prevention part is formed.

17. The manufacturing method of claim 10, further comprising, after the forming of the plating spreading prevention part, forming external electrodes on an outer portion of the magnetic body so as to be connected to end portions of the internal coil part,

wherein the external electrodes include conductive resin layers and plating layers formed on the conductive resin layers.