LIGHT EMITTING UNIT
First Claim
1. A light emitting unit, comprising:
- a plate substrate having a flat top surface;
a semiconductor structure comprising a plurality of light emitting dices and an encapsulant covering the light emitting dices;
a carrier board on which the plate substrate and the semiconductor structure are disposed; and
a patterned conductive layer formed on electrodes of the light emitting dices and electrically connected to the carrier board, wherein the encapsulant is located between the plate substrate and the carrier board.
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Accused Products
Abstract
A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.
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Citations
20 Claims
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1. A light emitting unit, comprising:
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a plate substrate having a flat top surface; a semiconductor structure comprising a plurality of light emitting dices and an encapsulant covering the light emitting dices; a carrier board on which the plate substrate and the semiconductor structure are disposed; and a patterned conductive layer formed on electrodes of the light emitting dices and electrically connected to the carrier board, wherein the encapsulant is located between the plate substrate and the carrier board. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A light emitting unit, comprising:
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a substrate; an encapsulant containing a phosphor material; a plurality of light emitting dices; and an external circuit comprising a first patterned conductive layer, wherein the encapsulant is located between the substrate and the external circuit and covers the light emitting dices, and the light emitting dices are coupled to the external circuit via the first patterned conductive layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A light emitting unit, comprising:
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a semiconductor structure comprising a light transmissive layer, a plurality of light emitting dices and an encapsulant comprising a phosphor material, wherein the encapsulant is disposed between the light transmissive layer and the light emitting dices, and the phosphor material covers the light emitting dices; and an external circuit comprising a set of wirings, wherein the light emitting dices are mounted to the external circuit and electrically connected to the set of wirings, and the encapsulant is sandwiched by the light transmissive layer and the external circuit. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification