PROTECTIVE WINDOW FOR AN INFRARED SENSOR ARRAY

• US 20160088240A1
• Filed: 09/11/2015
• Published: 03/24/2016
• Est. Priority Date: 09/23/2014
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Kostrzewa, Joseph, Covington, Bruce, Posch, Chris
• Granted Patent: US 10,182,195 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

Various embodiments of the present disclosure may include a focal plane array configured to capture thermal image data from a scene. The embodiments may further include a sensor window displaced a first distance from the focal plane array. The embodiments may also include a protective window displaced a second distance greater than the first distance from the focal plane array, wherein the second distance causes damage or debris incident on the protective window to be out of focus in the thermal image data.

Claims

1. A device comprising:

a focal plane array configured to capture thermal image data from a scene;

a sensor window displaced a first distance from the focal plane array; and

a protective window displaced a second distance greater than the first distance from the focal plane array, wherein the second distance is predetermined such that damage or debris incident on the protective window is out of focus in the thermal image data.

2. The device of claim 1, wherein the protective window prevents image artifacts in the thermal image data resulting from environmental factors to the sensor window.

3. The device of claim 1, further comprising:

a first frame for the protective window, wherein the first frame provides a protective window assembly; and

an alignment aperture in the first frame.

4. The device of claim 3, further comprising:

a second frame for the focal plane array, wherein the second frame forms a vacuum packaged assembly with the sensor window and the focal plane array; and

an alignment pin on the second frame, wherein the alignment pin configured to align the second frame with the first frame or additional optics.

5. The device of claim 1, further comprising:

a sealing mechanism configured to join together the focal plane array, the sensor window, and the protective window, wherein the sealing mechanism prevents damage and debris collection on the sensor window.

6. The device of claim 1, further comprising:

a printed circuit board assembly attachable to the focal plane array and configured to process the thermal image data.

7. The device of claim 6, further comprising:

a first spacer between the focal plane array and the printed circuit board assembly.

8. The device of claim 7, further comprising:

a second spacer connected to the printed circuit board assembly and configured to connect to additional image processing electronics.

9. The device of claim 1, wherein the second distance comprises a distance from the protective window to the sensor window greater than approximately 0.060 inches.

10. The device of claim 1, wherein the device comprises an infrared camera.

11. A method comprising operating the device of claim 1 to capture the thermal image data from the scene.

20. The method of claim 11, wherein the second distance comprises a distance from the protective window to the sensor window greater than approximately 0.060 inches.

12. A method comprising:

providing a focal plane array configured to capture thermal image data from a scene;

providing a sensor window displaced at a first distance from the focal plane array; and

providing a protective window displaced a second distance greater than the first distance from the focal plane array, wherein the second distance is predetermined such that damage or debris incident on the protective window is out of focus in the thermal image data.

13. The method of claim 12, wherein the protective window prevents image artifacts in the thermal image data resulting from environmental factors to the sensor window.

14. The method of claim 12, further comprising:

providing a first frame for the protective window, wherein the first frame provides a protective window assembly; and

providing an alignment aperture in the first frame.

15. The method of claims 12, further comprising:

providing a second frame for the focal plane array, wherein the second frame forms a vacuum packaged assembly with the sensor window and the focal plane array; and

providing an alignment pin on the second frame, wherein the alignment pin configured to align the second frame with the first frame or additional optics.

16. The method of claim 15, further comprising:

sealing the focal plane array, the sensor window, and the protective window together using a sealing mechanism, wherein the sealing mechanism prevents damage and debris collection on the sensor window.

17. The method of claim 12, further comprising:

providing a printed circuit board assembly that is detachable from the focal plane array, wherein the printed circuit board assembly is configured to process the thermal image data.

18. The method of claim 17, further comprising:

providing a first spacer between the focal plane array and the printed circuit board assembly.

19. The method of claim 18, further comprising:

providing a second spacer to the printed circuit board assembly, wherein the threaded spacer is configured to connect to additional image processing electronics.