POWER SUPPLY ARRANGEMENT FOR SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor device, comprising:
- a device die comprising a first circuit and a second circuit;
a first power supply die electrically coupled to the first circuit and configured to supply power for the first circuit; and
a second power supply die different from the first power supply die, the second power supply die electrically coupled to the second circuit and configured to supply power for the second circuit,wherein the first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.
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Abstract
A semiconductor device includes a device die, a first power supply die, and a second power supply die different from the first power supply die. The device die includes a first circuit and a second circuit. The first power supply die is electrically coupled to the first circuit and configured to supply power for the first circuit. The second power supply die is electrically coupled to the second circuit and configured to supply power for the second circuit. The first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.
16 Citations
28 Claims
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1. A semiconductor device, comprising:
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a device die comprising a first circuit and a second circuit; a first power supply die electrically coupled to the first circuit and configured to supply power for the first circuit; and a second power supply die different from the first power supply die, the second power supply die electrically coupled to the second circuit and configured to supply power for the second circuit, wherein the first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13-20. -20. (canceled)
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21. A semiconductor device, comprising:
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a device die comprising a first circuit and a second circuit; a first power supply die electrically coupled to the first circuit and configured to supply power to the first circuit; and a second power supply die electrically coupled to the second circuit and configured to supply power to the second circuit, wherein, the first power supply die at least partially overlaps the first circuit and the second power supply die at least partially overlaps the second circuit. - View Dependent Claims (22, 23, 24, 25)
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26. A semiconductor device, comprising:
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a device die comprising a first circuit and a second circuit; a re-distribution layer attached to the device die; a first power supply die attached to the re-distribution layer and configured to supply power to the first circuit through the re-distribution layer; and a second power supply die attached to the re-distribution layer and configured to supply power to the second circuit through the re-distribution layer. - View Dependent Claims (27, 28)
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Specification