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POWER SUPPLY ARRANGEMENT FOR SEMICONDUCTOR DEVICE

  • US 20160093588A1
  • Filed: 09/25/2014
  • Published: 03/31/2016
  • Est. Priority Date: 09/25/2014
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a device die comprising a first circuit and a second circuit;

    a first power supply die electrically coupled to the first circuit and configured to supply power for the first circuit; and

    a second power supply die different from the first power supply die, the second power supply die electrically coupled to the second circuit and configured to supply power for the second circuit,wherein the first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.

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