Method of Manufacturing a Semiconductor Device and Semiconductor Device
First Claim
1. A method of manufacturing a semiconductor device including a transistor, comprising:
- forming field plate trenches in a main surface of a semiconductor substrate, a drift zone being defined between adjacent field plate trenches;
forming a field dielectric layer in the field plate trenches;
thereafter, forming gate trenches in the main surface of the semiconductor substrate, a channel region being defined between adjacent gate trenches; and
forming a conductive material in at least some of the field plate trenches and in at least some of the gate trenches,the method further comprising forming a source region and forming a drain region in the main surface of the semiconductor substrate.
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Accused Products
Abstract
A method of manufacturing a semiconductor device including a transistor comprises forming field plate trenches in a main surface of a semiconductor substrate, a drift zone being defined between adjacent field plate trenches, forming a field dielectric layer in the field plate trenches, thereafter, forming gate trenches in the main surface of the semiconductor substrate, a channel region being defined between adjacent gate trenches, and forming a conductive material in at least some of the field plate trenches and in at least some of the gate trenches. The method further comprising forming a source region and forming a drain region in the main surface of the semiconductor substrate.
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Citations
20 Claims
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1. A method of manufacturing a semiconductor device including a transistor, comprising:
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forming field plate trenches in a main surface of a semiconductor substrate, a drift zone being defined between adjacent field plate trenches; forming a field dielectric layer in the field plate trenches; thereafter, forming gate trenches in the main surface of the semiconductor substrate, a channel region being defined between adjacent gate trenches; and forming a conductive material in at least some of the field plate trenches and in at least some of the gate trenches, the method further comprising forming a source region and forming a drain region in the main surface of the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a semiconductor device including a transistor, comprising:
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forming field plate trenches in a main surface of a semiconductor substrate, a drift zone being defined between adjacent field plate trenches; forming a field dielectric layer in the field plate trenches; thereafter, forming gate trenches in the main surface of the semiconductor substrate, a channel region being defined between adjacent gate trenches; and forming a conductive material in at least some of the field plate trenches and in at least some of the gate trenches, wherein each of the field plate trenches and each of the gate trenches is formed to extend in the first horizontal direction, adjacent ones of the field plate trenches and of the gate trenches being disposed along a second horizontal direction perpendicular to the first direction.
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16. A semiconductor device comprising a transistor including:
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field plate trenches in a main surface of a semiconductor substrate, a drift zone being defined between adjacent field plate trenches; a dielectric layer at sidewalls of the field plate trenches; gate trenches in the main surface of the semiconductor substrate, a channel region being defined between adjacent gate trenches; and a conductive material in at least some of the field plate trenches and in at least some of the gate trenches, wherein the channel region is defined in the semiconductor substrate between adjacent gate trenches, the dielectric layer being disposed over an upper surface of the channel region, the semiconductor device further comprising a source region and a drain region in the main surface. - View Dependent Claims (17, 18, 19, 20)
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Specification