METHOD FOR MANUFACTURING LIGHT EMITTING UNIT

• US 20160093766A1
• Filed: 12/03/2015
• Published: 03/31/2016
• Est. Priority Date: 07/14/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Ting, Shao-Ying, Huang, Kuan-Chieh, Huang, Jing-En, Huang, Yi-Ru, Wu, Sie-Jhan, Ke, Long-Lin
• Granted Patent: US 9,859,459 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 : Heat extraction or cooling elements
• CPC Class Codes: H05B 45/46 : having LEDs disposed in parallel lines

Abstract

A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Claims

1. A method for manufacturing light emitting units, comprising:

providing a semiconductor structure comprising a plurality of light emitting dices;

forming an encapsulant covering the light emitting dices;

mounting the light emitting dices to a patterned conductive layer coupled to a carrier board, wherein the light emitting dices are electrically connected to the patterned conductive layer;

providing a substrate on the encapsulant, wherein the encapsulant is located between the substrate and the light emitting dices; and

cutting the substrate, the encapsulant, the semiconductor structure, and the carrier board so as to obtain the light emitting units.

2. The method for manufacturing the light emitting units as claimed in claim 1, wherein the encapsulant is doped with a phosphor material comprising a yellow phosphor, a red phosphor, a green phosphor, a blue phosphor, a yttrium aluminium garnet phosphor or combinations thereof.

3. The method for manufacturing the light emitting units as claimed in claim 1, wherein each of the light emitting units comprises at least two light emitting dices, and the light emitting dices of the light emitting unit form a series circuit or a parallel circuit through the patterned conductive layer.

4. The method for manufacturing the light emitting units as claimed in claim 1, wherein the substrate at least comprises a substantially flat top surface.

5. The method for manufacturing the light emitting units as claimed in claim 1, wherein a material of the patterned conductive layer and a material of a plurality of electrodes of the light emitting dices are the same.

6. The method for manufacturing the light emitting units as claimed in claim 1 further comprising:

providing a heat dissipation element disposed on the circuit board.

7. The method for manufacturing the light emitting units as claimed in claim 1, wherein a material of the substrate comprises resin, glass, ceramic or sapphire.

8. A method of manufacturing light emitting units, comprising:

providing a semiconductor structure comprising a substrate, a phosphor-containing encapsulant, a plurality of light emitting dices and an external circuit, wherein the phosphor-containing encapsulant covers the light emitting dices located between the substrate and the external circuit, and a patterned conductive layer is formed on electrodes of the light emitting dices and is physically coupled to the external circuit; and

cutting the semiconductor structure so as to obtain the light emitting units.

9. The method for manufacturing the light emitting units as claimed in claim 8, wherein the phosphor-containing encapsulant comprises a yellow phosphor, a red phosphor, a green phosphor, a blue phosphor, a yttrium aluminium garnet phosphor or combinations thereof.

10. The method for manufacturing the light emitting units as claimed in claim 8, wherein each of the light emitting units comprises at least two light emitting dices, and the light emitting dices of the light emitting unit form a series circuit or a parallel circuit through the patterned conductive layer.

11. The method for manufacturing the light emitting units as claimed in claim 8, wherein the substrate at least comprises a substantially flat top surface.

12. The method for manufacturing the light emitting units as claimed in claim 8, wherein a material of the patterned conductive layer and a material of a plurality of electrodes of the light emitting dices are the same.

13. The method for manufacturing the light emitting units as claimed in claim 8 further comprising:

providing a heat dissipation element coupled to the external circuit.

14. The method for manufacturing the light emitting units as claimed in claim 8, wherein a material of the substrate comprises resin, glass, ceramic or sapphire.

15. A method of manufacturing light emitting units, comprising:

providing a semiconductor structure comprising a light transmissive layer, an encapsulant containing a phosphor material and a plurality of sets of light emitting dices, wherein the encapsulant covers the light emitting dices and is disposed between the light transmissive layer and the light emitting dices;

mounting a plurality of sets of wirings to the plurality of sets of light emitting dices to form series circuits and/or parallel circuits; and

performing a cutting process to obtain the light emitting units, wherein each of the light emitting units at least comprises one of the sets of light emitting dices and one of the sets of wirings.

16. The method for manufacturing the light emitting units as claimed in claim 15, wherein the light transmissive layer at least has a substantially flat top surface.

17. The method for manufacturing the light emitting units as claimed in claim 15, wherein each of the light emitting units comprises at least two light emitting dices.

18. The method for manufacturing the light emitting units as claimed in claim 15, wherein the sets of wirings are a patterned conductive layer formed on an external circuit.

19. The method for manufacturing the light emitting units as claimed in claim 15 further comprising:

providing a heat dissipation element coupled to an external circuit.

20. The method for manufacturing the light emitting units as claimed in claim 15, wherein a material of the light transmissive layer comprises resin, glass, ceramic or sapphire.