ORGANIC LIGHT-EMITTING DISPLAY DEVICE

• US 20160093827A1
• Filed: 09/28/2015
• Published: 03/31/2016
• Est. Priority Date: 09/29/2014
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: HAN, Myungwoo
• Granted Patent: US 9,911,943 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/00 Constructional details relating to the organic devices covered by this subclass
• CPC Class Codes: H10K 2102/3026 Top emission
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/123 Connection of the pixel electrodes to the thin film transistors [TFT]
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/851 Division of substrate

Abstract

An organic light-emitting display device is provided. The device can include a display area having an organic light-emitting element on a lower substrate; a bezel area surrounding the display area; a transparent encapsulation unit having first and second encapsulation layers, and a first particle cover; and a first buffer layer. The first encapsulation layer can cover the display area and the bezel area. The first particle cover layer can cover the display area and a portion of the bezel area adjacent to the display area. The first buffer layer, apart from the first particle cover layer, can cover another portion of the bezel area. The second encapsulation layer, which covers the first particle cover layer and the first buffer layer, contacts the first encapsulation layer at a contact surface between the first particle cover layer and the first buffer layer.

Claims

1. An organic light-emitting display device comprising:

a display area including a thin-film transistor and an organic light-emitting element on a lower substrate;

a bezel area configured to surround the display area;

a transparent encapsulation unit including at least a first encapsulation layer, a first particle cover layer and a second encapsulation layer; and

a first buffer layer,

wherein the first encapsulation layer, on the organic light-emitting element, covers the display area and the bezel area,

wherein the first particle cover layer, on the first encapsulation layer, covers the display area and at least a portion of the bezel area adjacent to the display area,

wherein the first buffer layer, apart from the first particle cover layer, on the first encapsulation layer, covers at least another portion of the bezel area, and

wherein the second encapsulation layer, which covers the first particle cover layer and the first buffer layer, is in contact with the first encapsulation layer at a contact surface between the first particle cover layer and the first buffer layer.

2. The organic light-emitting display device of claim 1, wherein a width of the contact surface is determined by a distance between the first buffer layer and the first particle cover layer.

3. The organic light-emitting display device of claim 2, wherein the width of the contact surface is equal to or less than approximately 200 μ

m.

4. The organic light-emitting display device of claim 2, wherein the width of the contact surface is equal to or greater than approximately 50 μ

m.

5. The organic light-emitting display device of claim 1, further comprising an upper substrate facing the lower substrate and an adhesive layer between the lower substrate and the upper substrate,

wherein the first buffer layer is configured to reduce an area between the upper substrate and the lower substrate at the bezel area such that the adhesive layer fills up the reduced area at the bezel area.

6. The organic light-emitting display device of claim 5, wherein the first buffer layer is made of a same material as the first particle cover layer.

7. The organic light-emitting display device of claim 6, wherein the first buffer layer is configured to absorb physical impacts generated when the lower substrate and the upper substrate are cut.

8. The organic light-emitting display device of claim 6, further comprising a second buffer layer under the first buffer layer and configured to further reduce the area between the upper substrate and the lower substrate at the bezel area, the second buffer layer being made of a same material as the bank layer.

9. The organic light-emitting display device of claim 8, wherein the second buffer layer has a flat top surface.

10. The organic light-emitting display device of claim 8, wherein the first buffer layer is overlapped with the second buffer layer and a width of the second buffer layer is wider than a width of the first buffer layer.

11. The organic light-emitting display device of claim 8, further comprising a third buffer layer under the second buffer layer,

wherein the third buffer layer is made of a same material as a planarization layer and is configured to further reduce the area between the upper substrate and the lower substrate at the bezel area.

12. The organic light-emitting display device of claim 11, wherein the second buffer layer is overlapped with the third buffer layer and a width of the third buffer layer is wider than the width of the second buffer layer.

13. The organic light-emitting display device of claim 1, wherein the first encapsulation layer and the second encapsulation layer are made of an inorganic substance, and the first particle cover layer and the first buffer layer are made of an organic substance.

14. The organic light-emitting display device of claim 1, further comprising an upper substrate facing the lower substrate, wherein the organic light-emitting display device is a top emission type in which light generated in the organic light-emitting element is emitted via the upper substrate.

15. The organic light-emitting display device of claim 5, wherein a thickness of the adhesive layer is equal to or less than approximately 20 μ

m.