DISMANTLING DEVICE AND METHOD FOR DISMANTLING BLACKLIGHT UNIT

• US 20160095268A1
• Filed: 11/24/2014
• Published: 03/31/2016
• Est. Priority Date: 09/26/2014
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Original Assignee: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Inventors: WANG, Linlin, QIAN, Zhiyu, MENG, Qinglong, ZHAO, Yinchu
• Granted Patent: US 10,459,287 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02F 1/1303 Apparatus specially adapted to the manufacture of LCDs
• CPC Class Codes: G02F 1/1309 Repairing; Testing
• CPC Class Codes: G02F 1/1336 Illuminating devices
• CPC Class Codes: Y10T 29/53 Means to assemble or disassemble

Abstract

A dismantling device and a method for dismantling a backlight unit are provided, and the dismantling method includes: placing a liquid crystal module that includes a liquid crystal panel and a backlight unit placed oppositely and connected by a bonding portion onto a supporting table; bringing a line cutting portion that includes two ends and a cutting line therebetween into a gap between the liquid crystal panel and the backlight unit, with at least one of the two ends and the liquid crystal module configured to be movable with respect to each other; and applying a cutting force upon the bonding portion with the line cutting portion along a plane where the bonding portion is located, so as to separate the backlight unit from the liquid crystal panel. This method decreases the force upon the backlight unit to reduce chances of damaging the backlight unit during dismantling the same.

Claims

1. A dismantling device, comprising:

a supporting table comprising a supporting face which is configured for supporting an object to be dismantled thereon; and

a linear cutting portion, provided on the supporting face, and configured to be movable with respect to the supporting table so as to apply a cutting force on a bonding portion of the object to be dismantled along a plane where the bonding portion is located,

wherein the linear cutting portion comprises two ends and a cutting line between the two ends, and at least one of which is provided on the supporting table.

2. The dismantling device according to claim 1, wherein

the two ends comprise a free end and a fixed end which is provided on the supporting table, and the free end is configured to be rotatable above the supporting face;

or

both the two ends are fixed ends provided on the supporting table, and the supporting face is configured to be rotatable with respect to the line cutting portion on the supporting table.

3. The dismantling device according to claim 1, wherein

both the two ends are fixed ends provided on the supporting table, and the cutting line between the two fixed ends is configured to be movable in a translational manner with respect to the supporting face;

or

both the two ends are free ends provided on the supporting table, and the cutting line between the two free ends is configured to be movable in a translational manner with respect to the supporting face.

4. The dismantling device according to claim 1, wherein the object to be dismantled is a liquid crystal module comprising:

a liquid crystal panel and a backlight unit that are placed oppositely and connected with each other by a bonding portion, and a flexible printed circuit (FPC) board connected to a side of the liquid crystal panel, and

the dismantling device further comprises an FPC-end supporting portion provided at a side of the supporting table and used for placing the flexible printed circuit board of the liquid crystal module thereon, and the FPC-end supporting portion comprises a supporting pole supported on the supporting table.

5. The dismantling device according to claim 2, wherein the object to be dismantled is a liquid crystal module comprising a liquid crystal panel and a backlight unit that are placed oppositely and connected with each other by a bonding portion and a flexible printed circuit (FPC) board connected to a side of the liquid crystal panel,

the dismantling device further comprises an FPC-end supporting portion provided at a side of the supporting table and used for placing the flexible printed circuit board of the liquid crystal module thereon, and the FPC-end supporting portion comprises a supporting pole supported on the supporting table.

6. The dismantling device according to claim 3, wherein the object to be dismantled is a liquid crystal module comprising a liquid crystal panel and a backlight unit that are placed oppositely and connected with each other by a bonding portion and a flexible printed circuit (FPC) board connected to a side of the liquid crystal panel,

the dismantling device further comprises an FPC-end supporting portion provided at a side of the supporting table and used for placing the flexible printed circuit board of the liquid crystal module thereon, and the FPC-end supporting portion comprises a supporting pole supported on the supporting table.

7. The dismantling device according to claim 4, wherein at least one opening is formed between the FPC-end supporting portion and the supporting table, or

the FPC-end supporting portion comprises at least one opening, and

the cutting line of the line cutting portion is configured to be able to move in the at least one opening and pass through the same in use.

8. The dismantling device according to claim 4, wherein the FPC-end supporting portion comprises a slant-face supporting structure used for placement of the flexible printed circuit board, and the slant-face supporting structure is provided at the side of the FPC-end supporting portion away from the supporting table.

9. The dismantling device according to claim 1, further comprising a first positioning portion provided on the supporting table and configured for preventing the object to be dismantled from moving on the supporting face along a first direction.

10. The dismantling device according to claim 9, further comprising a second positioning portion provided on the supporting table and configured for preventing the object to be dismantled from moving on the supporting face along a second direction, wherein the second direction forms a certain angle with the first direction.

11. The dismantling device according to claim 10, wherein at least one of the first positioning portion and the second positioning portion is provided onto the supporting table in a magnetic adsorption manner.

12. The dismantling device according to claim 10, wherein at least one of the first positioning portion and the second positioning portion comprises at least one columnar or plate-shaped structure.

13. The dismantling device according to claim 1, wherein at least one of the two ends of the line cutting portion comprises a cutting line receiving portion configured for receiving and releasing the cutting line.

14. The dismantling device according to claim 1, wherein the supporting face is provided with a vacuum adsorption device comprising a plurality of adsorption apertures.

15. The dismantling device according to claim 14, wherein the vacuum adsorption device comprises a plurality of division frames, and the plurality of the division frames divide the vacuum adsorption device into a plurality of zones, each of which corresponds to different adsorption apertures.

16. A method for dismantling a backlight unit, comprising:

placing a liquid crystal module onto a supporting table, wherein the liquid crystal module comprises a liquid crystal panel and a backlight unit that are placed oppositely and connected by a bonding portion;

bringing a line cutting portion into a gap between the liquid crystal panel and the backlight unit, wherein the line cutting portion comprises two ends and a cutting line between the two ends, and at least one of the two ends and the liquid crystal module are configured to be movable with respect to each other; and

applying a cutting force upon the bonding portion with the line cutting portion along a plane where the bonding portion is located, so as to separate the backlight unit from the liquid crystal panel.

17. The method according to claim 16, wherein

the line cutting portion applies the cutting force upon the bonding portion during its rotation or translational motion;

or

the line cutting portion applies the cutting force upon the bonding portion during the rotation or translational motion of the liquid crystal module.

18. The method according to claim 16, wherein the line cutting portion applies the cutting force to a long side or a short side of the bonding portion.

19. The method according to any one of claim 16, further comprising:

before bringing the line cutting portion into the gap between the liquid crystal panel and the backlight unit, lifting a side of the liquid crystal panel and without the bonding portion toward a direction away from the backlight unit.

20. The method according to any one of claim 16, further comprising:

before bringing the line cutting portion into the gap between the liquid crystal panel and the backlight unit, supporting a flexible printed circuit board of the backlight unit onto a supporting face.