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NICKEL PHOSPHOROUS CMP COMPOSITIONS AND METHODS

  • US 20160102227A1
  • Filed: 10/13/2015
  • Published: 04/14/2016
  • Est. Priority Date: 10/14/2014
  • Status: Active Grant
First Claim
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1. A chemical mechanical polishing (CMP) composition for planarizing a nickel phosphorus (NiP) substrate, the composition comprising a suspension of about 1 to about 20 percent by weight (wt %) of colloidal silica particles and about 0.3 to about 10 wt % of fused silica particles in an acidic aqueous carrier comprising a primary oxidizing agent that includes hydrogen peroxide;

  • wherein the concentration of the fused silica particles is not more than about 100% of the concentration of the colloidal silica particles.

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