MEASURING DEVICE, IN PARTICULAR FOR USE IN THE PROCESS MEASUREMENT TECHNOLOGY, COMPRISING A CYLINDRICAL SENSOR TIP

• US 20160103020A1
• Filed: 05/12/2014
• Published: 04/14/2016
• Est. Priority Date: 05/14/2013
• Status: Active Grant

• Current Assignee: ifm electronic GmbH (ifm stiftung & Co. KG)
• Original Assignee: ifm electronic GmbH (ifm stiftung & Co. KG)
• Inventors: LIEHR, SEBASTIAN, REICHART, STEPHAN, REICHART, WALTER
• Granted Patent: US 10,309,837 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L

Abstract

A measuring device, in particular for use in the process measurement technology, including a cylindrical sensor tip which includes a closed housing, a sensor element disposed within the housing in the form of a temperature dependent resistor and for generating a sensor signal, and electronic components, which are connected to the sensor element via electrical connecting lines and/or a conductor film, wherein said sensor element is thermally connected to the housing by means of a solder and a heat conducting, electrically insulating layer is disposed between the sensor element and the solder is provided.

Claims

1. A measuring device, for use in the process measurement technology, including a cylindrical sensor tip which comprises a closed housing, a sensor element disposed within the housing in the form of a temperature dependent resistor and for generating a sensor signal, and electronic components, which are connected to the sensor element via electrical connecting lines and/or a conductor film,

wherein the sensor element is thermally connected to the housing by means of a solder and a heat conducting, electrically insulating layer is disposed between the sensor element and the solder,

wherein,

the housing has a step-like recess which is not penetrating the housing;

and

the thermally conductive, electrically insulating layer is configured as a ceramic substrate that covers the recess,

wherein the recess is disposed at the inside of the housing and is adapted to receive the solder, via which the sensor element is thermally connected to the housing, and wherein the solder distributes itself substantially uniform, i.e. with the same thickness, in the recess so that in the region of the recess between the housing wall and the ceramic substrate and hence also between the housing wall and the sensor element a defined distance is established.

2. The measuring device according to claim 1, wherein the step-like recess is formed by reducing the wall thickness of the housing.

3. The measuring device according to claim 1, wherein the step-like recess is formed by a forming process, in particular by deep drawing.

4. The measuring device according to claim 1, wherein the step-like recess is formed by an annular body resting on the inside of the housing.

5. The measuring device according to claim 1, wherein the recess has a depth in the range of 100-500 μ

m, preferably 100-300 μ

m, particularly preferably 150 μ

m.

6. The measuring device according to claim 1, wherein the step-like recess of the housing is disposed at the end face of its distal end.