CHIP ELECTRONIC COMPONENT

• US 20160104563A1
• Filed: 03/25/2015
• Published: 04/14/2016
• Est. Priority Date: 10/14/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: JEONG, Dong Jin, KIM, Sin Gon
• Application Number:
  US14/668,816
• Publication Number:
  US 20160104563A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/06 with core substantially closed in itself, e.g. toroid
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

There is provided a chip electronic component including: a magnetic body including an insulating substrate and having a size thereof in a length direction thereof larger than that in a width direction thereof; and an internal coil part provided on at least one surface of the insulating substrate, wherein a width of the internal coil part measured in the length direction of the magnetic body on the basis of the center of the magnetic body in the width direction thereof is larger than a width of the internal coil part measured in the width direction of the magnetic body on the basis of the center of the magnetic body in the length direction thereof.

Claims

1. A chip electronic component comprising:

a magnetic body including an insulating substrate and having a size thereof in a length direction thereof larger than that in a width direction thereof; and

an internal coil part provided on at least one surface of the insulating substrate,

wherein a width of the internal coil part measured in the length direction of the magnetic body on the basis of the center of the magnetic body in the width direction thereof is larger than a width of the internal coil part measured in the width direction of the magnetic body on the basis of the center of the magnetic body in the length direction thereof.

2. The chip electronic component of claim 1, wherein when the width of the internal coil part measured in the width direction of the magnetic body on the basis of the center of the magnetic body in the length direction thereof is a and the width of the internal coil part measured in the length direction of the magnetic body on the basis of the center of the magnetic body in the width direction thereof is b, 0.8<

a/b<

1 is satisfied.

3. The chip electronic component of claim 1, wherein the internal coil part has a spiral shape.

4. The chip electronic component of claim 1, wherein the insulating substrate has a through hole in a central portion thereof, the through hole being filled with a magnetic material to form a core part.

5. The chip electronic component of claim 4, wherein an area of the core part is larger than that of a core part which includes an internal coil part having a uniform width.

6. The chip electronic component of claim 1, wherein the internal coil part is exposed to an end surface of the magnetic body in the length direction thereof.

7. The chip electronic component of claim 1, wherein the internal coil part includes coil patterns which are provided on one surface of the insulating substrate and the other surface of the insulating substrate opposing one surface of the insulating substrate and are electrically connected to each other by a via electrode provided in the insulating substrate.

8. The chip electronic component of claim 1, wherein the internal coil part contains at least one selected from the group consisting of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), and platinum (Pt).

9. A chip electronic component comprising:

a magnetic body including an insulating substrate and having a size thereof in a length direction thereof larger than that in a width direction thereof;

an internal coil part provided on at least one surface of the insulating substrate and having a spiral shape; and

external electrodes provided on at least one end surface of the magnetic body in the length direction thereof and connected to the internal coil part,

wherein a width of the internal coil part in a region of the magnetic body adjacent to the end surface of the magnetic body in the length direction thereof is larger than that of the internal coil part in a region of the magnetic body adjacent to a side surface of the magnetic body in the width direction thereof.

10. The chip electronic component of claim 9, wherein when a width of the internal coil part measured in the width direction of the magnetic body on the basis of the center of the magnetic body in the length direction thereof is a and a width of the internal coil part measured in the length direction of the magnetic body on the basis of the center of the magnetic body in the width direction thereof is b, 0.8<

a/b<

1 is satisfied.

11. The chip electronic component of claim 9, wherein the insulating substrate has a through hole in a central portion thereof, the through hole being filled with a magnetic material to form a core part.

12. The chip electronic component of claim 11, wherein an area of the core part is larger than that of a core part which includes an internal coil part having a uniform width.

13. The chip electronic component of claim 9, wherein the internal coil part includes coil patterns which are provided on one surface of the insulating substrate and the other surface of the insulating substrate opposing one surface of the insulating substrate and are electrically connected to each other by a via electrode provided in the insulating substrate.