CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

• US 20160104564A1
• Filed: 04/20/2015
• Published: 04/14/2016
• Est. Priority Date: 10/14/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: JEONG, Dong Jin
• Application Number:
  US14/691,285
• Publication Number:
  US 20160104564A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/06 with core substantially closed in itself, e.g. toroid
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

There are provided a chip electronic component and aboard having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

Claims

1. A chip electronic component comprising:

a substrate;

a first internal coil part disposed on one surface of the substrate;

a second internal coil part disposed on the other surface of the substrate opposing one surface thereof;

a via penetrating through the substrate to connect the first and second internal coil parts to each other; and

first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via,

wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

2. The chip electronic component of claim 1, wherein the portions of the first and second internal coil parts adjacent to the first and second via pads are shaped as recessed portions to be insulated from the first and second via pads.

3. The chip electronic component of claim 2, wherein the centers of the recessed portions and the centers of the first and second via pads coincide with each other.

4. The chip electronic component of claim 1, wherein the first via pad is formed by extending one end portion of the first internal coil part, and

the second via pad is formed by extending one end portion of the second internal coil part.

5. The chip electronic component of claim 1, wherein the first and second internal coil parts and the first and second via pads are formed by plating.

6. The chip electronic component of claim 1, wherein the first and second via pads and the portions of the first and second internal coil parts adjacent thereto have an interval of 3 μ

m or more therebetween.

7. The chip electronic component of claim 1, further comprising a magnetic body enclosing the first and second internal coil parts,

wherein the magnetic body contains a magnetic metal powder.

8. The chip electronic component of claim 1, wherein the substrate has a through hole which is disposed in a central portion of the substrate, and

the through hole is filled with a magnetic material to form a core part.

9. The chip electronic component of claim 7, wherein end portions of the first and second internal coil parts are extended to form lead portions exposed to at least one surface of the magnetic body.

10. A board having a chip electronic component, the board comprising:

a printed circuit board on which first and second electrode pads are provided;

the chip electronic component of claim 1, mounted on the printed circuit board.

11. The board of claim 10, wherein the portions of the first and second internal coil parts adjacent to the first and second via pads are shaped as recessed portions to be insulated from the first and second via pads.

12. The board of claim 11, wherein the centers of the recessed portions and the centers of the first and second via pads coincide with each other.

13. The board of claim 10, wherein the first via pad is formed by extending one end portion of the first internal coil part, and

the second via pad is formed by extending one end portion of the second internal coil part.

14. The board of claim 10, wherein the first and second internal coil parts and the first and second via pads are formed by plating.

15. The board of claim 10, wherein the first and second via pads and the portions of the first and second internal coil parts adjacent thereto have an interval of 3 μ

m or more therebetween.

16. The board of claim 10, wherein the chip electronic component further includes a magnetic body enclosing the first and second internal coil parts,

the magnetic body containing magnetic metal powder.

17. The board of claim 10, wherein the substrate has a through hole which is disposed in a central portion of the substrate, and

the through hole is filled with a magnetic material to form a core part.

18. The board of claim 16, wherein end portions of the first and second internal coil parts are extended to form lead portions exposed to at least one surface of the magnetic body.