HEAT DISSIPATION DEVICE

• US 20160106006A1
• Filed: 11/13/2013
• Published: 04/14/2016
• Est. Priority Date: 05/20/2013
• Status: Active Grant

• Current Assignee: ZTE Corporation
• Original Assignee: ZTE Corporation
• Inventors: HOU, Fangxi
• Granted Patent: US 9,674,987 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01R 12/722 coupling devices mounted on the edge of the printed circuits
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

Provided is a heat dissipation device. The heat dissipation device includes a thermal conductive plate (1), a shape of which is the same as a shape of a Secure Digital (SD) card. The thermal conductive plate (1) is used to be inserted into an SD card connector, and partially contacts with at least one inner surface of the SD card connector; the thermal conductive plate (1) is made of thermal conductive metallic material, and one or more contacting parts (10) of the thermal conductive plate (1) that contact with the SD card connector are set to be thermal conductive metallic material, and outer surfaces (12), other than the one or more contacting parts (10), of the thermal conductive plate (1) are set to be insulating material. The present technical solution solves the problem that the implementing effect of heat dissipation schemes already existed for terminals is fairly bad in the related technologies, and improves heat conduction and heat dissipation speed. The heat dissipation device occupies less space in the terminal, and enhances heat dissipation efficiency.

Claims

1. A heat dissipation device, comprising a thermal conductive plate (1), a shape of which is the same as a shape of a Secure Digital (SD) card, wherein the thermal conductive plate (1) is used to be inserted into an SD card connector and partially contacts with at least one inner surface of the SD card connector;

the thermal conductive plate (1) is made of thermal conductive metallic material, and one or more contacting parts (10) of the thermal conductive plate (1) that contact with the SD card connector are set to be thermal conductive metallic material, and outer surfaces (12), other than the one or more contacting parts (10), of the thermal conductive plate (1) are set to be insulating material.

2. The heat dissipation device according to claim 1, wherein the heat dissipation device further comprises a thermal conductive cable (2) connected to the thermal conductive plate (1).

3. The heat dissipation device according to claim 2, further comprising an extension thermal conductive plate (3), wherein one end of the thermal conductive cable (2) is connected to the thermal conductive plate (1), and the other end of the thermal conductive cable (2) is connected to the extension thermal conductive plate (3).

4. The heat dissipation device according to claim 3, wherein the extension thermal conductive plate (3) is made of metallic material or heat storage material.